BEDROCK RYZEN R8000

1st industrial PC with AMD Ryzen Embedded 8000
Ryzen AI and Hailo AI for over 100 TOPS Generative AI / Inferencing
State of the art thermal design for operation in -40ºC to 85ºC
10 years guaranteed availability

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AMD Ryzen Embedded 8000 Performance, Efficiency & 10 Year Longevity

Bedrock R8000 is powered by the state-of-the-art AMD Ryzen Embedded 8000 processor with 8 Zen 4 cores and 16 threads running at up to 5.1 GHz.
It is the most power efficient high-performance x86 CPU on the market for compute and graphics workloads. Ryzen Embedded 8000 incorporates AMD Pro technology for enhanced reliability and security and has 10 years guaranteed availability.

4 Types of AI Engines, over 100 TOPS

Ryzen Embedded 8000 has an integrated Ryzen AI NPU rated at 16 TOPS. The full processor performance scales up to 39 TOPS. Additionally, Bedrock R8000 supports two types of AI accelerators:

Hailo-8 achieves 26 TOPS and excels in AI Inferencing

The new Hailo-10 is optimized for Generative AI and provides 40 TOPS

Up to 3 AI accelerators can be installed in Bedrock R8000 with combined AI performance of over 100 TOPS.

Edge computing solutions improving real-time performance

Packed Solid with Features

The I/O, storage and networking devices found in Bedrock R8000 stand out in both performance and capacity. Thanks to its modular design Bedrock R8000 is available with either 4 displays + 2 GbE or 4 GbE + 2 displays. Bedrock R8000 is packed full with sockets for up to 96 GB DDR5 ECC, 3x NVME Gen4 2280 or up to 3 Hailo AI accelerators, WiFi 6E and 5G modem with dual SIM. I/O includes USB4 40 Gbps, extra 4 USB 3.2 ports and a console port. All these features are tightly packed in a fanless enclosure of under 1 liter.

Remarkable Fanless Cooling

Hot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heatpipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size.

Full Control of CPU Power

With Bedrock R8000 you don’t have to guess how much power the system draws. Instead you can precisely set CPU power limit across an exceptionally broad power range of 8W to 54W. This is particularly useful in scenarios where limited power has to be shared between the IPC and additional devices, and when integration constraints prevent ideal heat dissipation.

Rock Solid Reliability

Bedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems. DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation. RAM supports ECC. NVMe with power-loss-protection (PLP) can be ordered. Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM. The enclosure is extremely ruggedized – all-aluminum, fanless and ventless dust-resistant IP40.

Innovative Modular Design

Bedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:

SoM with the CPU, DDR5 and NVMe slots and all native interfaces on 380 pins of high density connectors.
Networking and I/O board (NIO) with NICs and ports.
Storage and Extension Cards board (SX) with slots for WiFi, 5G modem and extra NVMe devices.
Power Module (PM) with DC to DC converter and DC input connector.

This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support.

Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volume.

Painless Integration

The compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk.
SolidRun offers multiple types of mounting brackets, including lever-based DIN-Rail bracket with locking, wall mount, small stand and ruggedized stand.

Field Usability

As a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw.

The 0.6 liter Bedrock Tile

When integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible.
Bedrock Tile is designed for these use cases. The ribbed chassis walls are replaced with flat walls with blind threadings for fastening Bedrock Tile to a cold plate. A key feature of Bedrock Tile is that it preserves the 360º internal heat distribution so it can be cooled from either side. With thickness of just 29mm and volume of 0.6 liter, Bedrock Tile is easy to integrate in tight spaces. Having all connectors on one side further simplifies the integration.

Advanced Integration Using Deck

Some integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards). The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis.

Designing with Bedrock SoM

Bedrock SoM makes a convenient and flexible building block for board designers. For many developers, using Bedrock R8000 SoM would be the best way to develop a custom appliance based on AMD Ryzen Embedded 8000 series. Bedrock SoM makes an attractive platform for that purpose for several reasons.

The SoM is far more self-contained than traditional SoMs. It has not only the essential CPU and RAM, but also NVMe, direct DC input with 12V – 19V tolerance and RTC battery. The SoM is provided in a ruggedized metal skirt that protects the SoM, provides mounting fixture for extension cards and serves as a heat-spreader for secondary heat sources. Copper heat-plate is pre-assembled on the CPU.

Customers wishing to develop with Bedrock SoM are welcome to contact SolidRun.

Feature	Specification	Notes
CPU	AMD Ryzen™ Embedded 8000 Series \| Ryzen™ Pro 8040 Series 8C/16T Zen4 4nm Up to 5.2 GHz Up to 54W	Ryzen 9 Pro 8945HS Ryzen Embedded 8845HS Ryzen Embedded 8840U
GPU	AMD Radeon™ 780M	Up to 6 WGPs / 12 CU @ 2800 MHz
NPU	AMD Ryzen™ AI 16 TOPS
AI Acceleration	Up to 3x Hailo-8 M.2 AI Inferencing Acceleration Module 26 TOPS Up to 2x Hailo-10 M.2 Generative AI Acceleration Module 40 TOPS	2x M.2 key-M 2242 (each precludes an NVME) 1x M.2 key-E 2230 (precludes WiFi)
RAM	128 bit DDR5 5600 up to 96 GB ECC / non-ECC	2x SODIMM (2×32 bit each), conduction cooled
TPM	fTPM 2.0 (in Ryzen) + dTPM 2.0 (Infineon)	Select in BIOS
Display	Up to 4 display outputs HDMI 2.1 \| DisplayPort 2.1	Max resolution / refresh rate: 7680×4320 @ 60Hz 3840×2160 @ 240Hz
Storage	Up to 3x NVMe PCIe Gen4 x 4	M.2 key-M 2280 Optional power-loss-protection NVMe is conduction cooled Each 2nd/3rd NVMe precludes one Hailo-8 key-M
LAN	Up to 4x 2.5 GbE (Intel I226)	4x RJ45 (NIO R8000 4X25) \| 2x RJ45 (NIO R7000 Basic)
WLAN	WiFi 6E (Intel AX210) BT 5.3	2x RP-SMA antennas Optional and upgradable (M.2 key-E 2230)
Modem	4G / 5G (Quectel)	2x SMA antennas Optional and upgradable (M.2 key-B 3042 / 3052)
USB	Up to 1x USB 4.0 40 Gb/s 1x USB 3.2 gen 2 10 Gb/s 3x USB 3.2 gen 2 5 Gb/s	Connectors: USB-C / USB-A
Console	Serial over USB	mini-USB connector
BIOS	AMI Aptio V	Dual SPI FLASH for redundancy Console redirection
Operating systems	Windows 10/11/IoT, Linux	Other x86 operating systems supported
Power	Up to 12V-60V DC	Phoenix terminal Other DC connectors available
Temperature range	Up to -40ºC to 85ºC	Also available in commercial temperature range
Enclosure	All aluminum enclosure, fanless cooling
Dimensions	30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting	DIN-rail, wall, VESA, table top

This form is for Bedrock R8000 only.

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Welpro SARL
https://welpro.biz/boutique/industrial-box-mini-pc/din-rail-embedded-pcs/bedrock-pc-r8000-r8x60/
Immeuble BAMA, 4eme Etage Bureau 21, ACI 2000, BAMAKO.
[email protected]
+223 90 02 60 02 / +223 82 02 70 02

Industrial Personal Computer 2U SARL
https://ipc2u.com/search/?q=SolidRun
Rue Des Iles Kerguelen Parc Edonia – Batiment M, 35760 Saint-Gregorie, France.
[email protected]
+33(0)230963006

Industrial Personal Computer 2U GmbH
https://ipc2u.de/search/?context=catalog&q=SolidRun
Frankenring 6, D-30855 Langenhagen, Germany.
[email protected]
+49 511 807259-0

Zentrica Ltd
https://www.zentrica.com/suppliers/embedded/solidrun/
Unit 8, City Business Centre, Hyde Street, Winchester, SO23 7TA, United Kingdom.
Tim Williams
[email protected]
01256 884999

Attractec.de
https://attractec.de/grundgestein/
Mandel Straße 29, 10409, Berlin, Deutschland.
[email protected]
+49 (0)30 – 86 38 95 96

Attractec
https://attractec.com/web/bedrock/
Hagilad St. 25a, Yokneam, Israel.
[email protected]

PEILA INT S.R.L
www.peila-international.com/featured-product/bedrock-r7000
Sector 1, 26-30 Constantin D. Aricescu St.,3rd floor Office 14 Ap.6 Room 2, Bucharest, Romania.
[email protected]

Peila Ltd
https://www.peila-international.com/categories/solidrun
Uri Lesser 8 Tel-Aviv, Israel.
[email protected]
03-5109955

StartIT Kft.
www.mini-pc.eu/en/bedrock-v3000
Keszeg utca 38. Vác 2600, Hungary.
István Pongrácz
[email protected]
[email protected]
+36 20 4489 581

RISC
https://www.risc.ch/index.php/
produkte/solidrun
Honerethof 6, Bergdietikon, 8962, Schweiz.
Heinz Rosenberg
[email protected]
+41 44 242 80 60

Assured Systems Americas
www.assured-systems.com/search/Bedrock/?post_type=product
1309 Coffeen Avenue, Ste 1200, Sheridan, WY 82801, USA.
James Priest
[email protected]
+ 1 347 719 4508

Assured Systems EMEA
www.assured-systems.com/search/Bedrock/?post_type=product
Unit A5, Douglas Park, Opal Way, Stone Business Park, Stone, Staffs, ST15 0YJ, UK.
James Priest
[email protected]
+ 44 1785 8790 50

YS TechSystems
www.ys-techsystems.com/bedrock-v3000/
Perach Alilah 189, Had Nes, Israel.
Shlomi Azar
[email protected]
+972 5426 99846

Nord Technology A/S
https://www.nordtechnology.dk/en/solidrun-launches-bedrock-r8000-future-proof-edge-ai/
World Trade Center, Borupvang 3, 2750 Ballerup, Denmark.
Kevin Peter Gade
[email protected]
+45 7027 0415

Things Embedded Limited UK
https://things-embedded.com/uk/solidrun/
7 Westover Drive, Stone, Staffordshire, ST15 8TT, United Kingdom
Andrew Whitehouse
[email protected]
UK: +44 7538 403 968

Things Embedded Limited USA
https://things-embedded.com/us/solidrun/
4117 Fairview Vista Point Apt. 104, Orlando, 32804 Florida
Andrew Whitehouse
[email protected]
US: +1 864 558 9087