HoneyComb Ryzen V3000: A High-Performance Embedded Platform Designed for Developers

At SolidRun, we understand the pressures engineers and developers face when building next-gen edge and embedded systems: tight schedules, demanding performance targets, complex networking requirements, and harsh deployment environments. That’s why we created the HoneyComb Ryzen V3000 development platform. This modular, Mini-ITX carrier board is powered by our proven AMD Ryzen V3000 COM Express 7 (CEX7) module, and was designed to help you move from concept to deployment faster, without compromising on performance, customization, or reliability.

Built Around AMD Ryzen V3000 for Real-World Edge Performance

At the heart of the platform is SolidRun’s CX7 module, featuring the 8-core/16-thread AMD Ryzen Embedded V3C18I processor (1.9GHz base, up to 3.8GHz boost), paired with 64GB of DDR5 memory. Whether you’re handling compute-intensive workloads, edge AI inferencing, or complex networking tasks, this system delivers serious muscle in a small footprint.

With PCIe Gen4 NVMe storage, blazing-fast dual 10GbE SFP+ networking, and a wide operating temperature range (-40°C to 85°C), it’s built to withstand the demands of industrial, edge, and networking environments, without breaking a sweat.

Ready for Prototyping, Scalable for Deployment

One of the biggest challenges in embedded development is going from prototype to production. The HoneyComb Ryzen V3000 platform helps bridge that gap.

Want to test your design with real workloads? Drop in our Ryzen V3000 Comm Express 7 module and go.
Need to tailor the carrier board to your application? The Mini-ITX form factor is customizable to match your I/O needs.
Building for extreme temperatures or low-power edge environments? The platform supports configurable TDPs from 15W to 45W, making it versatile for a wide range of deployment scenarios.

It’s a development platform that behaves like a production-ready system, so what you build in the lab behaves the same in the field.

Here’s what’s in the box:

Flexible I/O for Complex Applications

HoneyComb Carrier Board	Ryzen V3000 CX7 Module
Form Factor: Mini-ITX with integrated heatsink and powered CPU cooler	Form Factor: COM Express Type 7
Storage: M.2 PCIe Gen4 x4 + 2x SATA Gen3	CPU: AMD Ryzen V3C18I (8C/16T) Clock Speed: 1.9GHz base / 3.8GHz boost
Networking: Dual 10GbE SFP+	Networking: Dual 10Gb MACs
Connectivity: PCIe Gen4, UART, USB 2.0, USB 3.2	Memory: 64GB DDR5
Operating Temp: -40°C to 85°C	PCIe: Up to 20 lanes Gen4

Built for Edge Compute, Networking, and More

This platform isn’t limited to one use case. It’s engineered for flexibility and scale. Key target applications include:

Edge Networking: Dual 10GbE and high-speed PCIe make it ideal for data-forwarding and routing solutions.
Edge Compute: High core count and memory bandwidth enable analytics, control, and logic at the edge.
Edge AI: Need to add AI acceleration? Plug in your PCIe GPU or AI inference card.
Software-Defined Networking (SDN): DPDK and SPDK support ensure low-latency, high-throughput packet processing.
Storage Platforms: NVMe and PCIe Gen4 give you the bandwidth you need for high-performance storage appliances.

Available Now with Long-Term Support

The HoneyComb Ryzen V3000 development platform is available now through SolidRun and comes with our full suite of software development tools and support. As with all our embedded products, you can count on long-term availability and stable product lifecycle support. This commitment means that the platform you prototype with today can scale into production tomorrow.

Whether you’re building rugged industrial controllers, edge AI platforms, or SDN appliances, the HoneyComb Ryzen V3000 platform gives you a head start, and the freedom to build your way.

Ready to get learn more? Click here to visit the HoneyComb V3000 product page.

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