PowerPCB 5.0

PCB Power Integrity Design & Analysis/ HyperLynx® Power Integrity (PI) addresses the many power complexities faced by today’s PCB designers. Some of these challenges include: Increasing variety of voltages utilized by ICs, Dramatic increases of consumption, Reduced layer counts, Finer-pitch BGA footprints that perforate copper planes, interfering with DC voltage and current supply. With inadequate power delivery, designs can exhibit seemingly intermittent signal integrity issues, which cause the logic on the board to fail. If power delivery is extremely poor, there can be complete part failure due to inadequate voltage and/or current resulting in a non-functional design. In severe cases, poor power delivery can lead to thermal issues, reliability issues, and actual copper failure.