Tentoma steigert Kapazität und Flexibilität mit neuer Multi Film Unit

Tentoma A/S stellt die neue MFU Multi Film Unit (zum Patent angemeldet) vor: ein innovatives Foliengestell, entwickelt für RoRo StretchPack Haubenstretchverpackungen. Mit der MFU reagiert das Unternehmen auf die wachsende Nachfrage nach höherer Kapazität und effizienterer Handhabung verschiedener Foliengrößen auf einer Verpackungslinie. Ein Foliengestell – mehrere Folienrollen Der entscheidende Vorteil der neuen MFU Multi Film […]

Feature

IPCO – „Gemeinsam können wir komplette Prozesslinien anbieten!“

Mit der Übernahme von New Era Converting Machinery Inc. durch IPCO AB ist ein neuer globaler Anbieter für Converting- und Prozessanlagen entstanden. Im Gespräch erläutern Jens Gegner, Global Segment Manager Composites bei IPCO, und Paul Lembo, Managing Director von New Era, wie sich die Zusammenarbeit entwickelt, welche Synergien sich ergeben – und wo die Reise […]

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OLED microdisplay with 2K resolution (2,048 × 2,048 pixels, 1.07 inch).

27. April 2026 |

Fraunhofer IPMS develops innovative 2K OLED microdisplay

Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have developed an innovative 2K OLED microdisplay. They will present initial results at SID Display Week 2026 in Los Angeles, USA, from 5-7 May 2026, at Booth 1146. OLED microdisplays are a mature technology for generating high-resolution images for a wide range of optical applications. Recently, […]

Protected forest through AI-supported, miniaturised sensor technology for environmental monitoring

31. März 2026 |

Fraunhofer IPMS – AI-enabled miniaturised sensor technology

Fraunhofer Institute for Photonic Microsystems IPMS, together with the Helmholtz Centre for Environmental Research (UFZ) and the Center for Applied Research and Technology e.V. (ZAFT), is launching the FastSense research project – Innovative sensor technology and AI for environmental and hazardous substance monitoring. The project aims to develop a portable, fast measurement system combining state-of-the-art […]

Chip as the basis for high-precision electrical examination of layers

25. März 2026 |

Fraunhofer IPMS expects a new level of thin-film characterisation

The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop an innovative measurement system for precise thin-film characterisation. This system will enable experiments to be conducted under variable conditions, setting new standards in the characterisation of organic materials. Thin films in […]

19. März 2026 |

VTT-originating startups attract €445M equity funding in 2025

In 2025, six VTT-originating startups secured a combined €445 million in equity funding. Notably, each of these funding rounds exceeded €10 million. The Finnish startup sector has grown to over 12.5 billion euros in turnover and offers high-value-added jobs to over 50.000 people. The year 2025 was record-breaking for Finnish deep tech companies that are […]

A map of Europe with participating locations

16. März 2026 |

Imec launches university consortium around next-gen chips

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first-of-its-kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit […]