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Knowledge Hub

The knowledge and expertise which resides within Logitech spans many industries, many countries and many years.

Welcome to our Knowledge Hub; the place for expert written resources. These documents are to help our clients achieve the best possible results from their application and from all of our products

Case Studies

Princeton University and Logitech: Large-Format Geological Thin Section Installation – Geology, Art, and Storytelling in Stone

Brochures

Precision Jigs Range

Case Studies

The University of Augsburg – Institute of Physics

Application Notes

Gallium Arsenide Wafer Processing with LP70

Application Notes

Silicon Carbide, Sapphire & Gallium Nitride Substrate Preparation

Application Notes

Advances in InP Processing Using Logitech PM6

Application Notes

Processing III-V Semiconductors – Indium Phosphide (InP)

Application Notes

Geological Thin Section Preparation using the LP70

Application Notes

Polishing of Ultra-Thin Fused Wafer Processing

Whitepaper

No Soft Touch – Only Automated Systems Can Boost Productivity and Quality When Lapping & Polishing Fragile GaAs Wafers

Whitepaper

Enhancing Automation and Reliability in Silicon Wafer Processing: Unlock the Key to High-Precision, High-Throughput Lapping & Polishing for Semiconductor Fabrication

Brochures

VCB2 & VCB7 Vacuum Chuck Mounting Blocks

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VS2 Vacuum Unit

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GTS1 – Thin Section Cut-Off & Trim Saw

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LG2 Autocollimator

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Thin Section Bonding Jigs

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Sample Loading Gauge

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CG10 Contact Measurement Gauge

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G120 Flatness Measurement System

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Modular Wafer Substrate Bonding Unit

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Wafer Substrate Bonding Unit

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IU30 – Vacuum Impregnation Unit

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Fume Cabinet for CP3000 Chemical Polishing Machine

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CMP Tribo High Speed – Chemical & Chemical Mechanical Polishing System

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CP3000 – Chemical Polishing Machine

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CMP Orbis – Chemical & Chemical Mechanical Polishing

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CMP Tribo – Chemical & Chemical Mechanical Polishing System

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WG6 – Lapping & Polishing System

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PM6 – Precision Lapping & Polishing System

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LP70 – Multi-Station Lapping and Polishing System

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DL81/82 – Lapping & Polishing System

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Technology Transfer Programme

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Optics Material Processing

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Semiconductor Wafer Processing

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Geological Thin Section Preparation

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Consumable Product Catalogue

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Product Overview Brochure: Pioneers in the Discipline of Precision Materials Processing for over 50 years

Case Studies

Cardiff University – Chemical Mechanical Polishing of Thin Film Diamond

Case Studies

Colorado School of Mines – Thin Section Laboratory