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50 years of expertise

01 We are experts in high precision materials processing, shaping and surface finishing technologies.

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Advanced precision solutions

02 Precision processing for semiconductors, optics, and geology, driven by decades of Logitech innovation, with solutions adaptable to a wide range of industries and applications.

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OUR PRODUCTS
Our products are engineered to the highest standards, ensuring reliability, accuracy, and long-term performance.
Logitech is a world leader in materials processing, shaping, and surface finishing technologies. We specialize in the design and manufacture of precision lapping & polishing, chemical or chemical-mechanical polishing, cutting, and bonding equipment. Our adaptable system solutions are aimed at applications with the need for high specification surface finishes, prepared with the most precise geometric accuracy.
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Lapping & Polishing
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Chemical Polishing & Chemical Mechanical Polishing

PRODUCT SPOTLIGHT

DL81/82 Lapping and Polishing System

OVERVIEW
  • Flexible Configurations – DL82 (two automatic) or DL81 (one automatic, one manual), supporting 700 mm plates and two air jigs with Bluetooth flatness control and real-time thickness feedback.
  • Advanced Jig Handling – Adjustable air jigs (2–40 kg, 47 kg option) with automated lifting and inversion to prevent over-processing. In-situ load cells ensure precise calibration.
  • Optimized Processing – Multi-stage lapping/polishing with four 3.8 L cylinders and a metered abrasive feed (5-100 ml/min). Sealed system with exhaust port for safe hazardous material handling.
  • Smart Control & Monitoring – 15” touch-screen, USB data extraction, real-time monitoring, and recipe mode for repeatability. EtherCAT diagnostics and traffic light alerts enhance oversight.

KNOWLEDGE HUB

Our Latest Insights and Articles

Application Note

Gallium Arsenide Wafer Processing with LP70

Application Note

Advances in InP Processing Using Logitech PM6

Brochure

Advances in the Discipline of Precision Materials Processing

News & Events

Logitech to Attend Semicon China 2026

Case Study

Colorado School of Mines – Thin Section Preparation

Visit our Knowledge Hub for more articles, whitepapers and case studies