Electronics

Latest
Electronics

Pixel-Flo raises over £5 million to tackle microLED bottleneck

University of Sheffield spinout raises £5.25 million Seed round to tackle critical bottleneck in MicroLED manufacturing

New SiC-MOSFET relays from OMRON for high-voltage power and test applications

New 1,800V and 3,300V G3VH devices drive efficient, lightweight electrification

Schneider Electric launches new compact RCBO with overcurrent protection

To help customers meet wiring regulations without sacrificing on space

A-Gas Electronic Materials adds grayscale lithography to portfolio

A-Gas Electronic Materials is expanding its portfolio with mr-P 22G, a positive-tone…

Renesas acquires Pictorus to accelerate embedded application software development

Bringing Renesas closer to realising its digitalisation vision

New inductive displacement sensors from Micro-Epsilon provide micrometre precision and application flexibility

For precise, fast displacement measurements on metal targets in harsh environments

Element Six and Orbray prepare to accelerate wafer-scale single crystal diamond for production

The companies have established a reproducible process for 3-inch WSC diamond

Hoenle Adhesives launches new underfill material for advanced electronics

Designed to provide exceptional mechanical stability, thermal performance, and long-term reliability in…

Toshiba samples TB9M040FTG device for direct drive of compact automotive BLDC motors

Enables cost-efficient, space-saving designs in the sub-40W power range

Why end-of-life GPU hardware is too valuable to scrap

Precious metals can be up to 50x more abundant in e-waste than…

Free electronic design service from TAD electronics

This latest TAD offer enables customers to explore custom development without the…

Bressner Technology expands portfolio with the Digi Z45 Industrial Controller

New IoT controller for remote management and industrial automation

Diodes Incorporated and NMIS collaborate to improve efficiency in semiconductor manufacturing

Enhancing how production data is utilised on the factory floor through

ifm’s new generation of OGD distance sensors for diverse industrial applications

Advanced PMD time-of-flight technology delivers millimetre precision

AVK launches PowerPods for hyperscale data centres and AI infrastructure

PowerPods ensure faster deployment, easier scalability and less complexity

Parker expands SensoControl portfolio for modern connectivity and standardisation

The new controller family offers faster response times, improved accuracy, and an…

Why cooling hardware plays a critical role in semiconductor fabrication

Chemically etched flow plates help maintain stable operating conditions

PulseForge achieves sub-10µm silicon breakthrough in wafer processing

Photonic debonding of next-generation memory architectures fabricated on ultra-thin silicon wafers below…

AKM makes breakthrough in PCSEL optical sensing technology

Enabling 2µm-Band Infrared Laser Generation

Littelfuse expands its high-reliability TVS diode portfolio with SPD4-1 surface-mount devices

Engineered for avionics, military, and other mission-critical systems requiring robust transient protection

Bytesnap Design publishes its 2026 guide for PCB design requirements

For consumer, industrial and aerospace applications

Toshiba launches 40V N-channel MOSFET to enhance power supply efficiency

Featuring the latest-generation U-MOS11-H process

World’s first over 1-megapixel dual-abdn T2SL infrared sensor from Fujitsu

Developed to expand monitoring capabilities in defence and disaster prevention

Omron high-current DC relays for utility storage and charging infrastructure

New G9KD series handles 150A carry/break current at 1500V

New CPC1343G OptoMOS solid-state relay from Littelfuse

For high-current, high-isolation applications

New GaN charging solution from Renesas delivers 500W of power

For a wide range of industrial and IoT electronics

STMicroelectronics advances a new era of ultra-wideband technology

For automotive and smart device applications

New Cho-Therm HV Series thermally conductive pads to improve electrical insulation

Effective heat transfer while maintaining high electrical isolation

Synopsys’ vision for engineering the future

With new design, verification and simulation solutions

Electronics Digital Twin platform from Synopsys for accelerating physical AI development

Open platform enables seamless integrations with a comprehensive technology ecosystem and cloud‑based…

LAPP’s highly fire-resistant cable equipment

LAPP has mastered all CPR fire classifications up to class B2ca

Trending Posts

Pixel-Flo raises over £5 million to tackle microLED bottleneck

University of Sheffield spinout raises £5.25 million Seed round to tackle critical…

New LED UV spot curing system from Hoenle

Combining high irradiation intensity, flexible process control, and a compact, scalable design…

New SiC-MOSFET relays from OMRON for high-voltage power and test applications

New 1,800V and 3,300V G3VH devices drive efficient, lightweight electrification

norelem introduces control and monitoring devices with external contact blocks to portfolio

For safe switching commands and clear status indicators

Schneider Electric launches new compact RCBO with overcurrent protection

To help customers meet wiring regulations without sacrificing on space

A-Gas Electronic Materials adds grayscale lithography to portfolio

A-Gas Electronic Materials is expanding its portfolio with mr-P 22G, a positive-tone…