With new design, verification and simulation solutions
On March 11, Synopsys opened Synopsys Convergance 2026, its new flagship conference, with a keynote by Synopsys president and CEO, Sassine Ghazi, who shared his vision for a silicon-to-systems design paradigm and announced new engineering solutions across Synopsys’ portfolio
Ghazi said, "The complexity of next-generation intelligent systems requires a completely new engineering approach. By integrating co-design of software and hardware, electronics and physics, by harnessing digital twins to design, test, and refine products before physical production, and using AI to enhance human capabilities, customers' R&D teams can accelerate time to market of their intelligent systems. At Synopsys Converge, we're demonstrating the power of our silicon-to-systems engineering solutions that make us the best partner for engineering the future."
Additionally, Synopsys, AMD, and Microsoft are collaborating to enable faster access to Synopsys EDA tools on Microsoft platforms, powered by AMD compute.
Additional announcements included:
Multiphysics Fusion technology
Synopsys announced Multiphysics Fusion technology and the first wave of EDA solutions that integrate Ansys golden multiphysics engines into Synopsys’ EDA portfolio to address challenges in chip design caused by electromagnetics, thermal, and mechanical effects.
Voltage drop, thermal effects, and electromagnetic coupling have become challenges for heterogeneous designs at advanced nodes, affecting performance and reliability. Integrating multiphysics analysis into the design enables teams to identify and resolve issues earlier, with improved accuracy and correlation to final sign-off. This reduces design iterations and enhances power, performance, and area metrics, reshaping the process from overdesign to co-design.
The first solutions to incorporate Multiphysics Fusion technology address:
- Integrating voltage drop awareness and thermal analysis enables signoff for extreme operating conditions and strict reliability requirements, accelerating time-to-signoff.
- Thermal analysis and power integrity optimisation across the EDA stack, high-speed auto-routing with AI-driven signal integrity optimisation, enable thermal, IR, and stress analysis.
- Incorporating thermal and voltage-drop awareness accelerates design closure by enabling faster late-stage bug fixes, reducing design iterations, and improving PPA.
- Enabling greater electromagnetics accuracy and faster power integrity analysis for reliable analogue design.
These Multiphysics Fusion capabilities are in active beta engagements with early access customers, with production availability expected in the coming months.
Chip Design Paradigm with AgentEngineer Technology
Synopsys is developing AI capabilities with increasing levels of autonomy across its EDA solutions. Beginning with reinforcement learning and then building on generative AI capabilities in Synopsys.ai, the company is building an open agentic AI stack focused on orchestrated, multi-agent workflows to address use cases from silicon to systems.
Synopsys revealed an industry-first L4 agentic workflow for design and verification. Powered by AgentEngineer technology, the adaptive learning, multi-agent orchestrated system exhibits how agentic AI can augment human engineers and accelerate complex chip design tasks beyond traditional methods.
The workflow includes intelligent orchestration across Synopsys EDA agents with adaptive learning to generate Register Transfer Level (RTL) code from natural language and formal specifications, run Lint checks to ensure clean RTL, generate unit-level testbenches, and iteratively run verification with EDA tools to converge on target objectives.
This design process typically takes a team of verification engineers four to six months for a large SoC design using traditional methods. The Synopsys AgentEngineer-powered workflow has been shown to help customers improve productivity by 2x, with enhancements as great as 5x observed in select cases.
Synopsys’ agentic stack is developed on industry-standard SDKs and APIs to be interoperable with existing customer agents and data. The company is collaborating with AMD, Microsoft, and Nvidia to develop differentiated, agentic capabilities with increasing levels of autonomy. Synopsys is engaging with customers on this first multi-agent workflow and is committed to providing additional, orchestrated, multi-agent workflows for the design-to-manufacturing flow.
Ansys Product Release
Synopsys introduced the latest updates to its simulation portfolio, featuring integrated workflows across materials intelligence, functional safety, photonics design, and embedded systems. Marking the first major Ansys product release since the acquisition closed, Ansys 2026 R1 provides:
- New agentic and generative AI simulation capabilities, with the new Mesh Agent feature in Ansys Mechanical software, Ansys GeomAI, a new solution to generate, evaluate, and refine geometry concepts; and Discovery Validation Agent, an agentic AI partner that identifies setup issues using contextual intelligence and industry best practices.
- Synopsys technology integrations, including Synopsys VC Functional Safety Manager (VC FSM) and Ansys medini analysis software, creating an end-to-end workflow linking system- and chip-level safety analysis, automating traceability and eliminating manual data sharing; Synopsys QuantumATK and the Ansys Granta MI platform to integrate atomic-scale materials modelling with enterprise records; and Synopsis OptoCompiler and Ansys Lumerical FDTD software, connecting photonic device design to system-level optical simulation with automated Verilog-A model generation and consistent optical behaviour.
Software-Defined Hardware-Assisted Verification
Synopsys also shared advancements across its hardware-assisted verification (HAV) portfolio to help customers keep pace with the continued demand for AI compute and related verification productivity, enabling multi-die and AI chips from the data centre to the edge.
The company’s software-defined approach provides up to 2x higher performance on ZeBu Server 5 and up to 2x capacity scaling for modular HAV system targeting AI-era mega designs. Synopsys also revealed the HAPS-200 12 FPGA and ZeBu-200 12 FPGA platforms for mainstream designs, providing EP-Ready Hardware, 2x capacity, and expertise in software/hardware validation, power/performance analysis, and RTL verification. New, industry-first test automation enables faster, earlier detection of cache-coherency and subsystem-level bugs.
