All-silicon, solid-state active thermal management solution for Edge AI devices and low-power data center subsystems
Thin
Power
Airflow
Water and Dust
Vibration-free
µCooling™ delivers hyper-local, targeted airflow exactly where heat is generated, directly at the processor and other critical components, to manage heat.
µCooling powers ultra-thin, compact Edge AI devices with high-performance compute, increased power density, and advanced AI capabilities.
First in-module active cooling small enough to embed inside 400G, 800G, and 1.6T optical transceivers.
Delivers hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself.
Addresses hotspots in space-constrained edge deployments where liquid cooling is impractical.
See how µCooling delivers an immediate temperature drop and up to 30°C ΔT versus passive cooling.
XMC-2400 samples are available now. Contact us to start evaluating µCooling for your next design.
µCooling fan-on-a-chip delivers targeted, silent cooling right where it’s needed, reducing temperatures by 10–20°C in spaces where liquid cooling can’t reach.
First in-module active cooling small enough to embed inside 400G, 800G, and 1.6T optical transceivers.
Delivers hyper-localized active cooling directly to NAND flash and controller ICs from within the SSD itself.
Addresses hotspots in space-constrained edge deployments where liquid cooling is impractical.
See how µCooling lowers the PCB’s steady-state temperature to 64°C, compared to 77°C without it.
XMC-2400 samples are available now. Contact us to start evaluating µCooling for your next design.
Ultramobile & Edge AI
Dimensions
7.42 x 9.48 x 1.13 mm
Airflow
Up to 28cc/s
Back Pressure
Up to 1,300 Pa
Power Consumption
~150mW
Data Center & High-Density Systems
Dimensions
9.93 x 14.35 x 1.13 mm
Airflow
Up to 48cc/s (0.1 CFM)
Back Pressure
Up to 1,100 Pa
Power Consumption
~240mW
01 Piezoelectric Actuation
Thin-film piezoelectric material deposited on silicon expands and contracts at ultrasonic frequencies, converting electrical energy into mechanical motion.
02 Air Pulse Generation
Membranes vibrate above human hearing range, creating continuous high-velocity air pulses through precision micro-valve arrays on the chip.
03 Directed Airflow
Top-venting or side-venting packages direct cool air onto heat sources, or through isolated channels thermally coupled to target components.
04 Heat Dissipation
Localized forced convection dissipates heat from hotspots, sustaining component performance and extending hardware lifespan.
