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Singapore-based global FinTech platform @gftn_official, already a key partner in Odisha’s innovation journey, has now inaugurated its India operations office in Bhubaneswar
E&IT Department Odisha
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E&IT Department Odisha
@EIT_Odisha
Official Twitter handle of Electronics & Information Technology Department, Government of Odisha. All posts free for use under- CC by 4.0
- Odisha on its way to become a leading Fintech & GCC Hub. ✅ Students from First cohort of 5-month GFTN program placed with good jobs and salaries ✅ Global Fintech Companies keen on setting up offices in Bhubaneswar ✅ Black Swan Summit bringing Odisha in the global limelight
- E&IT Department Odisha reposted
🚀 Advancing Odisha’s semiconductor ambitions! A joint field inspection at Infovalley-II, Khordha identified 20 acres for M/s Sancode Semi Pvt. Ltd.’s proposed Advanced Semiconductor Packaging Manufacturing Unit, in collaboration with Inari Amertron Berhad, Malaysia.
- E&IT Department Odisha reposted
VIDEO | As Singapore-based Global Finance and Technology Network inaugurates its first office in India in Bhubaneswar, Odisha IT Secretary Vishal Dev says, "You see, GFTN, this program when we started it, it started off as a dream of establishing a major Fintech hub in
00:00 - E&IT Department Odisha reposted
Consulate General of India in New York, in association with @Wipro , convened an insightful discussion on Global Capability Centres (GCCs). The focus was also to promote @GIFTCity_ City & Odisha as attractive destinations for GCCs. @IFSCA_Official Chairperson Mr. K. Rajaraman
- E&IT Department Odisha reposted
ଓଡ଼ିଶା ହେବ ଭାରତର ସେମିକଣ୍ଡକ୍ଟର ଶକ୍ତିକେନ୍ଦ୍ର । ଓଡ଼ିଶା ସରକାର ଏବଂ ଇଣ୍ଟେଲ୍, 3DGS ମଧ୍ୟରେ ସ୍ୱାକ୍ଷରିତ MoU ଦ୍ୱାରା ରାଜ୍ୟର ଶିଳ୍ପ ଓ ପ୍ରଯୁକ୍ତିଗତ ବିକାଶରେ ଏକ ନୂତନ ଅଧ୍ୟାୟର ଶୁଭାରମ୍ଭ ହୋଇଛି । ଭୁବନେଶ୍ୱର–ଖୋର୍ଦ୍ଧା ଅଞ୍ଚଳରେ ସ୍ଥାପିତ ହେବାକୁ ଯାଉଥିବା ଅତ୍ୟାଧୁନିକ ଗ୍ଲାସ୍ କୋର୍ ସବ୍ଷ୍ଟ୍ରେଟ୍ ଉତ୍ପାଦନ କେନ୍ଦ୍ର
- E&IT Department Odisha reposted
A significant step forward in Odisha's semiconductor ambitions. @intel Corporation, 3DGS Inc., and the Government of Odisha signed an MoU on May 28, 2026 at Intel’s headquarters in Santa Clara, to explore the establishment of a world-class Advanced Semiconductor Glass Core
- E&IT Department Odisha reposted
The Government of Odisha signed a landmark MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. The initiative marks a significant milestone in the State’s industrial transformation,
- Odisha signs an MoU with Intel and 3DGS to explore an opportunity to establish advanced semiconductor glass core packaging substrate manufacturing facility in the State.
- Odisha emerging as a key node in India’s semiconductor future. 🇮🇳
- "Odisha’s talent ecosystem is ready to drive the chip revolution."
00:00 - From transit infrastructure to tech infrastructure. Odisha is redefining tech infrastructure by integrating mobility with opportunity. Baramunda Bus Terminal (BSABT), Bhubaneswar now offers ~30,000 sq. ft. of ready IT/ITES space for companies. For more details 👇
