Manufacturing Capabilities
PCB Manufacturing & Assembly Capabilities
Complete specification reference for FR-4 PCB, Flex PCB & SMT Stencil — GST invoice, INR payment, delivered across India.
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Layer Count | 1–32 Layers | The number of copper layers in the PCB | |
| Controlled Impedance | 4/6/8/10/12/14/16/18/20/…/32 layers | Available on multilayer boards with defined stackup options | |
| Impedance Tolerance | ±10% | Controlled impedance accuracy guarantee | |
| Material | FR-4 | Grade A laminates from suppliers including Nan Ya, KB, Shengyi and etc. |
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| Aluminium Core | 1-layer aluminium-core PCBs for high-power LED and thermal management. |
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| Copper Core | 1-layer copper-core PCBs with direct heatsink contacts to core (x > 1 mm). |
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| RF / High-Frequency | 1 oz copper, 2-layer PCBs with Rogers and PTFE cores for RF applications. |
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| FR-4 Dielectric Constants | 7628 Prepreg — 4.4 3313 Prepreg — 4.1 2116 Prepreg — 4.16 4.5 (2-Layer PCB) |
Dielectric constant values used for impedance calculation | |
| Maximum Dimensions | FR4 (1-layer): 500 × 510 mm FR4 (2-layer): 670 × 600 mm FR4 (4-layer): 663 × 593 mm FR4 (6-layer+): 458 × 586 mm Rogers/PTFE: 500 × 438 mm Aluminium PCB: 602 × 598 mm Copper PCB: 480 × 286 mm |
Limits apply to PCBs ≥ 0.8 mm thickness. 2-layer FR4 can reach 599 × 497 mm. 4-layer can reach 1020 × 600 mm. | |
| Minimum Dimensions | FR4 / Rogers / PTFE: 3 × 3 mm Castellated / Plated Edges: 10 × 10 mm Aluminium / Copper PCB: 5 × 5 mm |
Limits apply to PCBs ≥ 0.6 mm. Manual review required for thinner PCBs. Panelization recommended for small boards. | |
| Dimension Tolerance | ±0.2 mm | ±0.1 mm (precision) and ±0.2 mm (regular) for CNC routing; ±0.4 mm for V-scoring | |
| Thickness | 0.4 – 4.5 mm | Options: 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 mm. 2.5 mm and above for 12-layer PCBs only. |
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| Thickness Tolerance (≥1.0 mm) | ±10% | e.g. For 1.6 mm board thickness, the finished board ranges from 1.44 mm (T–10%) to 1.76 mm (T+10%) | |
| Thickness Tolerance (<1.0 mm) | ±0.1 mm | e.g. For 0.8 mm board thickness, the finished board ranges from 0.7 mm to 0.9 mm | |
| Finished Outer Layer Copper | 2-layer: 1 oz / 2 oz / 2.5 oz / 3.5 oz / 4.5 oz Multi-layer: 1 oz / 2 oz |
Standard outer copper weight. Heavy copper (2.5–4.5 oz) available on 2-layer boards only. |
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| Finished Inner Layer Copper | 0.5 oz / 1 oz / 2 oz | Finished copper weight of inner layer is 0.5 oz by default. |
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| Soldermask | Green · Purple · Red · Yellow · Blue · White · Black | We use LPI (Liquid Photo Imageable) solder mask. Heat-cured ink soldermask is usually found on low-cost, single-sided PCBs. |
Green
Purple
Red
Yellow
Blue
White
Black
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| Surface Finish | HASL (leaded / lead-free) · ENIG · OSP | FR4 has all three finishes available. 6+ layers and RF boards only have ENIG. Aluminium core boards only have HASL. Copper core boards only have OSP. |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Min Drill Size (PTH) | 0.2 mm | For multilayer; 0.3 mm for 2-layer boards |
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| Min Drill Size (NPTH) | 0.5 mm | Non-plated through hole minimum | |
| Max Drill Size | 6.3 mm | Maximum drill bit diameter | |
| Drill Tolerance (PTH) | ±0.08 mm | Finished hole size tolerance for plated holes | |
| Drill Tolerance (NPTH) | ±0.05 mm | Finished hole size tolerance for non-plated holes | |
| Min Annular Ring | 0.075 mm (3 mil) | Minimum copper pad ring width around a drilled hole |
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| Via-in-Pad (Min Drill) | 0.15 mm | Outer pad diameter must be ≥ 0.35 mm | |
| Min Hole-to-Hole Clearance | 0.5 mm (different nets) | 0.25 mm between holes on same net | |
| Slot Min Width | 0.6 mm | 0.5 mm for ENIG / OSP boards | |
| Blind & Buried Vias | Available (4-layer+) | Blind via starts from surface; buried via is internal only. |
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| Back Drill | Min stub length 0.15 mm | Used to reduce signal reflection in high-speed designs |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Min Trace Width (1 oz outer) | 0.127 mm (5 mil) | Recommended minimum for reliable production |
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| Min Trace Width (multilayer) | 0.089 mm (3.5 mil) | Available on 6-layer and above boards | |
| Min Trace Width (2 oz outer) | 0.16 mm (6.5 mil) | Required for heavier copper weights | |
| Min Trace Clearance (1 oz) | 0.127 mm (5 mil) | Minimum spacing between copper traces | |
| Min Trace Clearance (2 oz) | 0.16 mm (6.5 mil) | Minimum spacing for 2 oz copper | |
| Copper-to-Board Edge | ≥ 0.2 mm | Minimum clearance from copper to board edge | |
| Copper Pour to Drill | 0.254 mm | Minimum copper-to-hole edge clearance | |
| Trace to Drill Clearance | 0.5 mm | Minimum copper trace to drill hole edge | |
| BGA Fan-Out Min Trace | 0.075 mm (3 mil) | Ultra-fine trace for BGA component fan-out routing |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Soldermask Type | LPI (Liquid Photo Imageable) | Standard process for all FR-4 PCBs |
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| Min Soldermask Width | 0.1 mm | Minimum soldermask sliver between adjacent pads | |
| Min Opening Size | 0.1 mm | Minimum soldermask opening diameter | |
| Solder Mask Expansion | 0.05 mm (default) | Default mask opening beyond pad edge on each side | |
| Colors | Green · Purple · Red · Yellow · Blue · White · Black | Green is standard; other colors may have slightly longer lead times |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Legend Process | Inkjet / Screen Print | Inkjet printing for fine detail; screen print for standard volumes |
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| Min Line Width | 0.15 mm | Thinner lines may not print clearly | |
| Min Character Height | 0.8 mm | Minimum height for readable text | |
| Colors | White · Black | Selected based on soldermask color for maximum contrast |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Routing Method | CNC Routing · V-Scoring | CNC for irregular shapes; V-scoring for straight-line panel separation |
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| Outline Tolerance (CNC) | ±0.2 mm (regular) / ±0.1 mm (precision) | Precision routing available at additional cost | |
| Outline Tolerance (V-Score) | ±0.4 mm | Lower precision than CNC routing | |
| V-Score Remaining Thickness | 1/3 of board thickness | One third of board thickness remains after V-scoring | |
| Min CNC Router Bit | 0.8 mm | Affects minimum internal slot/cutout size | |
| Board Edge Clearance | ≥ 0.3 mm | Minimum copper-to-board-edge distance | |
| Castellated Holes | Min 0.6 mm diameter | Half-holes on board edge for module-to-board soldering |
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| Features | Capability | Description | Patterns |
|---|---|---|---|
| Layer Count | 1, 2, 4 | Standard flex layer configurations |  |
| Base Material | Polyimide (PI) / PET | PI for high-temperature; PET for cost-sensitive low-temp use | |
| Base Thickness | 12.5 / 25 / 50 µm | Thinner base allows tighter bend radius | |
| Copper Weight | 0.5 oz / 1 oz | 1/3 oz available for ultra-thin applications | |
| Dielectric Thickness | 25 / 50 µm | Insulating layer between copper and base film | |
| Coverlay Colors | Yellow · White · Black | Yellow (PI natural) is most common | |
| Surface Finish | ENIG only | Electroless Nickel Immersion Gold — ideal for flex | |
| Min Board Size | 20 × 20 mm | Smaller boards may require panelization | |
| Max Board Size | 234 × 490 mm | Maximum flex board dimensions | |
| Board Outline Tolerance | ±0.05 mm | Laser cutting provides high-precision outline | |
| Min Trace Width | 0.05 mm (2 mil) | Minimum achievable trace width on flex | |
| Min Trace Clearance | 0.05 mm (2 mil) | Minimum gap between traces | |
| Min Drill (PTH) | 0.15 mm | Plated through-hole minimum diameter | |
| Min Annular Ring | 0.075 mm | Pad ring width around drilled hole | |
| Bow & Twist | ≤ 1.5% | Flex boards have a higher bow allowance than rigid |
| Material | Thickness | Use Case | Patterns |
|---|---|---|---|
| FR-4 | 0.1 – 0.5 mm | Standard connector reinforcement zones |  |
| Polyimide (PI) | 0.075 / 0.1 / 0.125 mm | Flexible zone stiffening with matching material | |
| Steel | 0.1 / 0.2 mm | Heavy-duty reinforcement | |
| Aluminium | 0.2 / 0.5 / 1.0 mm | Heat dissipation plus rigidity | |
| Adhesive PSA | 0.05 / 0.1 mm | Pressure-sensitive adhesive for mounting |
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Material | 304 Stainless Steel (HTA) | High-tensile stainless steel for durability and precise aperture definition |  |
| Standard Thickness | 0.12 mm | Most common thickness for standard SMD components | |
| Thickness Range | 0.10 – 0.20 mm | Thinner for fine-pitch; thicker for large paste deposits | |
| Aperture Tolerance | ±0.003 mm | Laser-cut aperture dimensional accuracy | |
| Position Tolerance | ±0.005 mm | Aperture position accuracy from CAD data | |
| Min Aperture Width | 0.10 mm | Minimum laser-cut aperture opening | |
| Min Aperture Length | 0.10 mm | Minimum aperture length | |
| Min Bridge Width | 0.10 mm | Minimum steel bridge between adjacent apertures | |
| Area Ratio (recommended) | ≥ 0.66 | For 0.12 mm foil; ensures proper paste release from aperture walls |
| Type | Max Size | Notes | Patterns |
|---|---|---|---|
| Framed | 420 × 520 mm | Aluminium frame included; ready to mount on printer |  |
| Frameless | 420 × 520 mm | For use with universal tension frames | |
| Prototype | 240 × 200 mm | Low-cost option for prototyping runs |
| Treatment | Benefit | Recommended For | Patterns |
|---|---|---|---|
| No Treatment | Standard | General SMT assembly applications | |
| Electropolishing | Smoother aperture walls | Improved paste release for fine-pitch components (0.3 mm pitch and below) | |
| Nano Coating | Anti-adhesion surface | Reduces solder paste clogging; easier and faster cleaning | |
| Step Stencil | Variable thickness zones | Mixed components requiring different paste volumes on the same board |
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