Core chip technology

FlexICs – Flexible Integrated Circuits

FlexICs are ultra-thin, physically flexible chips with a low carbon footprint

Using indium gallium zinc oxide (IGZO) thin-film transistor (TFT) technology on a flexible substrate, they go where other semiconductors can’t. They take intelligence to new places and spaces – from system miniaturisation to item-level intelligence.

Built with standard, high-volume 300mm semiconductor processing, fabrication uses far less water and energy and fewer harmful chemicals, dramatically cutting their carbon footprint.

Discover flexible intelligence

Meet FlexICs: their unique characteristics, their customisation potential and their low-carbon manufacturing process.

EVP Engineering John Quigley describes the ‘wow!’ factor of FlexICs and the game-changing applications they enable.

About FlexIC technology

Ultra-thin

Physically flexible

Sustainable

Production cycle of just days

Enabling edge and item-level intelligence

Ideal for integration into mass-market items

FlexICs versus silicon chips: what’s the difference?

Materials

Silicon chips are built on rigid monocrystalline wafers. FlexICs use indium gallium zinc oxide (IGZO) thin-film technology (TFT) on an ultra-thin polyimide substrate.

Process

Silicon fabrication consists of hundreds of steps, many over 1000°C. FlexIC production uses around 30 steps, most at room temperature. No process exceeds 300°C.

Sustainability

Silicon is known for its massively energy-intensive production process. Due to its simplified process, FlexIC production uses less energy, less water, and fewer harmful gases.

Form factor

Silicon chips are rigid, brittle – and their thickness creates a detectable ‘bump’. FlexICs are flexible and ultra-thin – no lumps or bumps.

Performance

Silicon is still the gold standard for raw processing power. FlexICs are optimised for functional density and cost efficiency to add ‘just enough’ intelligence to everyday objects.

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NFC products

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Custom chips

FlexICs use industry-standard application-specific integrated circuit (ASIC) design flows to bring your designs to life.

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FAQs

What are FlexICs?

FlexICs – flexible integrated circuits – are low-cost, ultra-thin, physically flexible chips with a low carbon footprint. Instead of silicon, they use thin-film transistor technology on a flexible substrate.

How are FlexICs made?

While FlexIC manufacture is not unlike silicon fabrication, it’s much faster and takes place at much lower temperatures. First, a reusable carrier is spin coated with polyimide to create a flexible substrate. The process is fast, taking less than a day. The rest of the fabrication process – deposition, photo-patterning and etching – is also much simpler than for silicon, with fewer, shorter steps. This makes production much faster, and reduces use of energy, water and harmful chemicals, giving FlexICs a lower carbon footprint.

How do FlexICs differ from traditional silicon chips?

FlexICs differ in four key ways: form factor, cost, production time and sustainability. They use thin-film indium gallium zinc oxide (IGZO) technology on a flexible polyimide substrate instead of rigid silicon, making them physically flexible. They’re also made at low temperatures with fewer, shorter steps, which reduces energy, water and material use. This makes them more cost-effective, faster to produce – with turnaround in weeks – and far more sustainable than silicon chips.

What makes FlexICs sustainable?

FlexICs are manufactured using a shorter process and far lower temperatures than silicon, which reduces energy use, water consumption and reliance on harmful chemicals. They’re made using reusable carriers in modular, localised fabs that minimise logistics emissions. Their ultra-thin form also uses far less material than traditional integrated circuits.

How easy is it to design or customise a FlexIC?

The FlexIC Foundry gives you a fast, standardised path from design to production. With industry-standard tools and a comprehensive process design kit, you can create custom ASICs and iterate quickly. Turnaround happens in weeks, not months.

How do I know if FlexICs are right for my application?

If your product or system needs connect, sense and compute capabilities – particularly where flexibility is an asset – FlexICs are worth evaluating. They’re especially powerful in high-volume, cost-sensitive, or sustainability-driven environments.