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Digital light engines 
for the AI century

Redefining photonic integration to make light scalable, manufacturable, and infrastructure-ready.

Our digital light engines deliver higher output powers, smaller form-factors, broader bandwidth, and higher reliability - unlocking the next generation of AI data-center and sensing performance.​

Optical Power

>2x higher​

Form Factor

>10x smaller​

Power Density

>2x lower​

Photon Bridge Light Source

AI datacenters will be powered by
multi-color lights

 

AI datacenter bandwidth is doubling every two years, pushing networks beyond the limits of electrical interconnects.

The industry is turning to optical interconnects - enabled by silicon photonics and co-packaged optics (CPO) - to keep up.

At the heart of this shift are multi-color laser light sources, which make high-bandwidth, scalable optical connectivity possible.

We remove the final barrier to scalable photonics

Photon Bridge technology unlocks orders-of-magnitude improvements in manufacturability, power, and testability.

Manufacturability

Manufacturability

 100x faster bonding

Testability

Testability

Power Handling

Power-handling

  Rapid, straightforward testing
  No need for specialized alignment
      equipment

 50x larger silicon waveguide,
enabling >1W power handling

We move photonic integration from the wafer fab to scalable packaging

By combining III–V light sources with thick silicon waveguides, our cantilever platform delivers stable, manufacturable photonics through OSAT-based integration.

Our cantilever platform delivers <200 nm alignment accuracy at optical I/Os during high-speed (>2 µm) flip-chip bonding, unlocking unlimited I/Os per device and support for any III-V material system.​
With 25× lower wavelength variation, passive devices operate with little to no active tuning, reducing power, complexity, and cost.

Photon Bridge Wafer
Unlimited IOs

Unlimited optical IOs

Material Combination

Any material combination

Photonics Laser Grating

Simplified thermal controls

Applications


We bridge the gap between high-density silicon photonics and the physical world. By delivering high-power, multi-color laser sources, on silicon, we enable next-generation computing, lidar, and sensing solutions. 

Photon Bridge ELS
AI GPU
Photon Bridge logo

Co-Packaged Optics
(CPO)

External Laser

Sources​

LIDAR & Spectral

Sensing

LIDAR & Spectral  Sensing
Next Gen AI Datacenter

Connecting the hyperscalers

—  Ultra compact CPO/NPO​

—  High bandwidth density                  10’s Tbps/mm

Connecting the physical 

—  Light source infrastructure &        sensing​

 

—  High-power laser integration,​

      with low-cost manufacturing​​​

Physical AI

Latest news

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11 March 2026

Photon Bridge and CPFC Validate Path to Scalable Multi-Wavelength Light Engines

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7 March 2026

Eindhoven Laat Chips Praten met Licht - Eindhoven enables chips to communicate with light

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26 February 2026

Photon Bridge’s Modular Approach Aims to Simplify and Scale Photonic Chip Manufacturing

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