Let's Build

Electronics Manufacturing

Driven by a throughout DFM process and testing at every step. Up to 68 layers.
Along with standard PCBs, we provide HDI, Rigid-Flex and fine-pitch BGA boards at the highest quality standards.

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DFM

Seamless transition from design to production with reducing design iterations, costs and time-to-market.

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PCB/PCBA

Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.

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PCB Assembly

Precise connections for components like BGAs (pitch > 0.25mm). Supports AOI, X-Ray, ICT/FCT. Compliant with ISO and IPC standards.

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Testing & Debugging

Our engineering collaborates and executes thorough testing protocols, and documents results meticulously. Root cause analysis informs process enhancement.

PCB Layout

Transforming ideas into reality while minimizing production costs and maximizing efficiency
Cutting-edge layout Service with a capability of intricate designs with up to 56-layers, with impedance control, signal integrity (SI), Electromagnetic Compatibility (EMC). Ensuring timely and high-quality product deliveries.
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Standard Advanced
Layer Count 24 68
Max. Dimensions 584mm x 508mm (±0.13mm) 550mm x 900mm (±0.1mm)
Board Thickness 0.2 ~ 3.2mm (±10%) 0.1 - 10mm (±8%)
Copper weight (outer) 1 - 5 oz 1 - 18 oz
Copper Weight (inner) 0.5 ~ 3 oz 1/3 - 12 oz
Min Drill hole size 8 mil 6 mil
Min. Annular Ring 4 mil 3 mil
Min. Trace/Space inner layer 3 mil, outer layer 4 mil inner layer 2.5 mil, outer layer 3 mil
Min. Via 8 mil 6 mil
Min. BGA 10 mil 8 mil
Hole to hole clearance 14 mil 12 mil
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Design for Manufacturing

Seamless transition from design to production with reducing design iterations, costs and time-to-market.

Eligible experts working with industry tools, comply with the manufacturer capability to review prior production to eliminate defects as earlier as possible.

Share your designs in various formats, including ODB++, IPC2581, Gerber274x. Our expert engineers meticulously assess your requirements and select the most matched manufacturer profile based on your design specifications.

PCB Fabrication

Supports up to 68 layers, with Min Traces/Space at 3 mil. Microvia-based any layer HDI PCB is also capable.
Cutting-edge layout Service with a capability of intricate designs with up to 56-layers, with impedance control, signal integrity (SI), Electromagnetic Compatibility (EMC). Ensuring timely and high-quality product deliveries.
Rigid-Flex-PCB
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PCB Assembly

Supports Automatic Optical Inspection (AOI), X-Ray and In-Circuit Test/Functional Test (ICT/FCT) for quality assurance.

Covers soldering methods including reflow and wave soldering, precise connections for components such as BGAs pitch greater than 0.25mm. The smallest supported component size goes down to 01005 (0.2mm x 0.4mm).

Compliant with ISO 13485, IATF 16949 and ISO 9001. Acceptance criteria follows IPC standard demands.

Testing & Debugging

Conducting pre-shipment testing can significantly streamline the defect resolution process, ultimately saving valuable time.

Our engineering team collaborates closely with customers to fulfill testing requirements, ensuring the execution of thorough testing protocols and delivering comprehensive test results prior to shipment.

Defect-related test results are meticulously documented and undergo a thorough analysis to identify root causes, thereby informing and enhancing our subsequent processes.

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Component Sourcing

Specialize in procuring compatible components at competitive prices and lead times.

Engage directly with original manufacturers like NXP, TI, Murata, ST, Intel and etc, getting access to earlier emerging technology, and support throughout the design and prototype stages.

Moreover, our adept engineers excel in identifying alternatives during technical review, component shortages or end-of-life scenarios.