Custom FPGA / ARM control architecture design
Special communication protocol integration
High-speed multi-channel programming architecture optimization

Special test flow design
We design dedicated programming and test cores starting from the underlying architecture based on IC characteristics and production line requirements.

Case:
Custom Automotive-Grade MCU Programmer for Fudan Microelectronics
The customer required a dedicated programmer fully compatible with the special programming timing of their new automotive-grade MCU. We deeply customized the programming core based on FPGA architecture, completed verification with the customer’s IC flow in advance, and ensured programming stability met AEC-Q100 requirements. The delivered dedicated programmer passed customer validation early, greatly shortening their new product time-to-market.

New IC application development
Special package adaptation design
High / low temperature application optimization
Signal integrity enhancement design
We provide complete application verification and technical support for IC or packages without mature solutions in the market.

Case:
Custom Special Programming & Test Solution for ICown Microelectronics
The customer’s new IC required programming and functional verification under extreme temperatures, along with special surface marking requirements. We integrated high-low temperature test flows with customized laser marking, achieving stable programming across -40℃~125℃ and meeting high-precision marking needs, fully supporting customer new product reliability verification.

Custom High-Current Multi-Range Test System for Silan Microelectronics
The customer needed 1A~30A multi-range dynamic testing for power management IC, with no off-the-shelf solution available. We developed a programmable multi-range current test system supporting automatic switching between 1A, 2A, 5A, 10A, and 30A, with test accuracy and stability fully meeting mass production requirements, enabling rapid deployment of high-performance power IC.

Dedicated socket design
High-life structure optimization
High-temperature burn-in application design
Quick-change modular design
Comprehensive consideration of electrical, mechanical and lifetime design to ensure stability and maintenance efficiency in mass production.

Case:
Dual-Layer Test Sockets for Fudan Micro, Wuxi Tengxin, Shanghai Hualing
The customer needed to test IC of multiple package sizes on one platform. Traditional solutions required separate loadboards for each package, leading to high cost and long cycles. We developed dual-layer test sockets with shared loadboards, enabling quick switching between packages without repeated layout and fabrication. This reduced customer development cost by over 60% and shortened delivery time by 50%.

Custom positioning and recognition solutions
AOI process integration
Special mark reading optimization
Vision and programming flow integration
We provide complete vision integration development for assembly & test and automated production lines.

Pick & Place mechanism design
Multi-station integration
Burn-in test platform development
Line / MES system integration
We plan flexible automation platforms based on capacity scale and space constraints.

Case:
Automatic Burn-In Board Handling Equipment for Wuxi Tengxin, Hualing Shenci, Novosense
Manual handling of IC in Tray, Tape and Tube formats for burn-in caused low efficiency and high error rates. We developed flexible automatic handling equipment supporting automatic conversion and precise positioning of all three formats, with automatic alignment and insertion into burn-in board sockets. The system reduced labor in burn-in by 80% and increased throughput by 300%.