| Parameters | Custom Process Capability | Standarded |
|---|---|---|
| Chemical Gold Plating/Electronic Plating | Nickel Thickness ≥120u | |
| Completed Copper Foil Thickness | 0.5oz-5oz | 1oz-3oz |
| Drilling Diameter | ≥0.1mm | ≥0.2mm |
| Drilling- Aperture Tolerance | ±0.05mm | ±0.075-±0.08mm |
| Drilling- Hole Position Tolerance | ±0.05mm | ±0.075mm |
| Electroless Plating Copper Hole Wall Copper Thickness | 20um-50um | ≥20um |
| Etching Tolerance | ±0.01mm | ±20% |
| Gold Plating Thickness | 1-5u | |
| Impedance Tolerance | ±10% | |
| Inner Core Thinkness | 0.1-4.0mm | 0.2-2.0mm |
| Inner Layer Trace/Space | 2.5mil/3mil | 3mil/4mil |
| Legend Color | Green/Blue/Black/Red/White/Yellow | |
| Material Types | Rogers/Taconic/Arlon/Isola/Nelco/CHUKOH/FR-4/F4B/TP-2/High TG... | |
| Maximum Board Size | 480*800mm | 600*600mm |
| Outer Layer -Trace/Space | 2.5mil/3mil | 3mil/4mil |
| Plate Thickness Tolerance | ±0.1 | ±10% |
| Plug Hole Diameter | 0.15-0.6mm | 0.3-0.4mm |
| Process Capability Layers | 2-72 layers radio frequency PCB, Hybrid PCB, Multilayer HDI PCB | |
| Processing- BGA | ≥8mil | ≥12mil |
| Processing- Board Thickness | 0.1-10.0mm | 0.2-4.0mm |
| Processing- IC | ≥3mil | ≥6mil |
| Processing-Aspect Ratio | 14:01 | 10:01 |
| ProfilingType | Routing/Punching/V-CUT/Beveled Edges Laser Cutting | |
| Quality Control | Single and double Sided printed boards with plated-through holes technique standard GB4588.2-88, Design and Use of Printed Boards IPC-A-600G IPC-6015 | |
| Registration Precision | 2mil | 3mil |
| Registration Tolerance | ≤0.05mm | ≤0.1mm |
| Solder Mask Bridge | ≥3mil | ≥5mil |
| Solder Mask Color | Green/Blue/Black/Red/White/Yellow | |
| Solder Mask Thickness | 15-35um | |
| Surface Finish Options | ENIG/Gold Plating/Immersion Silver/Silver Plating/HASL/Gold finger/OSP/Nickel-palladium Gold/Resin plugging/Countersinking/ENIG+Hard Gold Plating/ImNi+ImTin/ENIG+OSP | |
| Thickness | 0.1-12mm | |
| Trace Width/Space | 6mil/6mil |
