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Advanced Packaging: A Key Technology For The Next Generation Of Electronics


In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the focus is increasingly shifting to the system level: How can processor cores, memory, sensors, and wireless modules be integrated as efficiently, compactly, and powerfully as possible within a sing... » read more

Do We Have Enough Standards For An Open-Chiplet Ecosystem?


For some time now, the semiconductor industry has been discussing the development of an open chiplet ecosystem. The idea is that, rather than having monolithic systems on a chip, it should be possible to combine smaller, specialized chiplets in a modular way – ideally across different manufacturers. Doing so would promise great flexibility with much shorter development times, resulting in muc... » read more

Lego-Style Software For Automotive And Industrial Chiplet Systems?


Chiplets are a key topic in the semiconductor industry today, as they offer the potential to greatly increase the performance and flexibility of chips. The current focus is primarily on implementation, in particular on the architecture and the development of die-to-die interfaces that enable efficient communication between the individual chips. These technologies hold out the promise of meeting... » read more

Advanced Packaging: A Curse Or A Blessing For Trustworthiness?


In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and critical infrastructure. These sectors depend on electronic systems that are not only powerful but also absolutely reliable and, above all, secure. This represents a major challenge, as the increasing co... » read more

Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions


Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers m... » read more

Efficient Electronics


Attention nowadays has turned to the energy consumption of systems that run on electricity. At the moment, the discussion is focused on electricity consumption in data centers: if this continues to rise at its current rate, it will account for a significant proportion of global electricity consumption in the future. Yet there are other, less visible electricity consumers whose power needs are a... » read more

Current And Future Challenges For An Open Chiplet Ecosystem


There are currently a variety of ways to approach chiplet systems. One is to have a closed system in which a manufacturer develops all the components in-house and is also in charge of commissioning and overseeing assembly. In this scenario, everything is coordinated within that company and no standards are required. Another is to establish open chiplet systems. This approach taps a considera... » read more

Chiplets: More Standards Needed


Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Edge AI And Chiplets


In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

Chiplets: Current Status


Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

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