Technology
diamond is the future platform for quantum
We believe that our diamond-based technology will shape 21st-century technology in the way silicon microchips shaped the 20th century.
Our microchips can operate in ambient conditions, be miniaturized, and manufactured using processes analogous to those used for silicon transistors in classical electronics.
By prioritizing utility and integration, we aim to make quantum technology accessible wherever it can deliver real value.
Ubiquitous quantum.
the diamond qubit: a robust foundation
Our technology is based on solid state diamond nitrogen-vacancy (NV) qubits, which deliver exceptional room-temperature performance due to diamond’s intrinsic stiffness, high purity, and low-noise crystal structure.
Atomic-scale qubits allow chip-scale devices with high qubit density, flexible architectures, simple control systems, and a clear path to scalable semiconductor-style manufacturing.
Long coherence times (> 1ms) are realistc for real world application.
Shot rate is 1kHz for computing and 100kHz–10MHz for sensing.
Operating at room temperature.
Achievable gate speeds around 1MHz.
Gate fidelity of > 99% has been demonstrated consistently in the field.
the diamond qubit: a robust foundation
Our technology is based on solid state diamond nitrogen-vacancy (NV) qubits, which deliver exceptional room-temperature performance due to diamond’s intrinsic stiffness, high purity, and low-noise crystal structure.
Atomic-scale qubits allow chip-scale devices with high qubit density, flexible architectures, simple control systems, and a clear path to scalable semiconductor-style manufacturing.
quantum layer
This layer contains the NV centers that host the quantum behavior, enabling the system to harness quantum effects.
intrinsic layer
NV centers must be well separated from sources of quantum noise elsewhere in the diamond because nearby doped layers, such as phosphorus-rich regions with free electrons, can cause decoherence.
N-/p-type layer
Doped diamond layer that enables electrical control of charge and fields, which is essential for stabilizing NV centers and operating diamond quantum devices. This allows photo-electric readout and ensures long coherence times.
diamond chip base layer
The diamond chip base layer, sourced externally, must meet strict material specifications to enable quantum applications.
functional diamond: a practical material
We functionalize diamond material by engineering its material layers to improve qubit performance.
We engineer the orientation of the NV centers and place qubits with atomic precision. This enables qubit-dense, robust chip-scale quantum devices.
This flexibility allows the diamond to be reconfigured for different modes and functions, so it can be tailored to specific sensing and computing applications and deliver useful quantum performance at room temperature.
NV arrays
Through our atomic scale fabrication (ASF) process we place NV centers within nm precision and form arrays of NV centers with aligned orientation. This is a key enabler for quantum computing.
2D NV layers
2D NV center layers of a few nm thickness. The orientation of the NV centers can be controlled via the diamond crystal orientation of (100) or (111). This is useful for computing and sensing applications.
3D NV ensembles
A 3D ensemble of NV centers distributed over the bulk diamond. High density of NV centers improve sensitivity for sensing applications.
placing qubits
We engineer NV orientation through the choice of diamond base-layer lattice orientation, including (100) and (111).
functional diamond: a practical material
We functionalize diamond material by engineering its material layers to improve qubit performance.
We engineer the orientation of the NV centers and place qubits with atomic precision. This enables qubit-dense, robust chip-scale quantum devices.
This flexibility allows the diamond to be reconfigured for different modes and functions, so it can be tailored to specific sensing and computing applications and deliver useful quantum performance at room temperature.
functional diamond: a practical material
We functionalize diamond material by engineering its material layers to improve qubit performance.
We engineer the orientation of the NV centers and place qubits with atomic precision. This enables qubit-dense, robust chip-scale quantum devices.
This flexibility allows the diamond to be reconfigured for different modes and functions, so it can be tailored to specific sensing and computing applications and deliver useful quantum performance at room temperature.
the smart diamond: an integrable platform
By combining our functionalized diamond with integrated photonic structures in the base layer and an electronic layer on top, we enable photoelectric readout of NV centers.
This on-diamond integration is a critical step toward chip-level integration, miniaturization, and robust quantum devices, and a key enabler of high-volume manufacturing.
These in-house developed technologies form together the smart diamond; the core building block of an integrable quantum chip that can be combined with electronic and photonic circuits to support different modes, functions, and applications.
electronic layer
Electronics for photoelectric (PE) readout are on-diamond electronic structures that collect charge generated during optical excitation of NV centres. They are essential because they enable fast, compact, and scalable electrical readout, replacing bulky optical systems and allowing quantum devices to be miniaturized and manufactured at scale. We have developed the key know-how for on-diamond electronics at nm scale and demonstrated PE readout, that can be transitioned to manufacturing scale.
optical guidance technology
We have developed key capabilities to enhance the light delivery for the initialization of the qubits. This allows to improve optical efficiency and increase the signal-to-noise ratio for PE readout.
the smart diamond: an integrable platform
By combining our functionalized diamond with integrated photonic structures in the base layer and an electronic layer on top, we enable photoelectric readout of NV centers.
This on-diamond integration is a critical step toward chip-level integration, miniaturization, and robust quantum devices, and a key enabler of high-volume manufacturing.
These in-house developed technologies form together the smart diamond; the core building block of an integrable quantum chip that can be combined with electronic and photonic circuits to support different modes, functions, and applications.
Integrable with external electronics, such as an Application Specific Integrated Circuit (ASIC) that generates the control signals, including pulses, for qubit control.
Integrable with external photonic circuits that provide additional optical infrastructure, such as sources and detectors.
the smart diamond: an integrable platform
By combining our functionalized diamond with integrated photonic structures in the base layer and an electronic layer on top, we enable photoelectric readout of NV centers.
This on-diamond integration is a critical step toward chip-level integration, miniaturization, and robust quantum devices, and a key enabler of high-volume manufacturing.
These in-house developed technologies form together the smart diamond; the core building block of an integrable quantum chip that can be combined with electronic and photonic circuits to support different modes, functions, and applications.
electronic components
The smart diamond can directly be connected to the control modules like ASIC, charge detector, and PIC. This allows for a tight integration and robust and miniaturized system.
photonic circuit
A photonic circuit is required for the initialization of the qubits. We source this technology from established suppliers and connect it to the photonic structure at the diamond.
smart diamond
PE readout on the chip allows the integration into a PCB.
Quantum System in Package (QSiP): a miniaturized and scalable system
Our system-level know-how, key IP, and in-house modelling and simulation tools enable seamless integration of the QSiP and standard OSAT manufacturing workflows.
This is a key driver that enables miniaturization and therefore adoption by the quantum sensing and computing markets.
Quantum System in Package (QSiP): a miniaturized and scalable system
Our system-level know-how, key IP, and in-house modelling and simulation tools enable seamless integration of the QSiP and standard OSAT manufacturing workflows.
This is a key driver that enables miniaturization and therefore adoption by the quantum sensing and computing markets.