| HD2-3x | HD2-3.5x | AJ5x | |
| FEATURES | |||
| – KEWA control software | X | X | X |
| – KEWB control software | X | X | |
| – NI machine vision software | X | ||
| – Cognex machine vision software | X | X | |
| – Heated vacuum platen | X | X | X |
| – Platen rotation (indexing) | X | ||
| – Alignment camera | X | X | X |
| – Fine feature alignment optics | X | X | |
| – Tiltable nozzle (0, 15, & 30deg) | X | X | X |
| – Pneumatic shutter | X | X | X |
| – Mechanical shutter | X | X | X |
| – Process camera | X | X | X |
| – Local (nozzle) exhaust | X | X | X |
| – Laser curing | X | X | |
| – UV curing | X | X | |
| – Laser (print head) height sensor | X | X | |
| – Interchangeable 4&5th axis trunnion | X | ||
| MOTION SYSTEM | |||
| – MOTION SYSTEM TYPE | XY: Rails on Granite / Ironless linear motors Z: Recirculating Ball Screw / Servo motor | XY: Rails on Granite / Ironless linear motors Z: Recirculating Ball Screw / Servo motor A: Indexing Rotary Table / Servo motor | XY: Ironless linear motor Z: Recirculating Ball Screw / Servo motor AC: Direct drive ironless servo motor |
| – WORK AREA | 300 x 300 x 100 mm | 250 x 350 x 200mm (3 axis) 200 x 200 x 200mm (5 axis) | |
| – ACCELERATION | 2.0g (XY) | 1.0g (XY) | |
| – ACCURACY | +/- 5um | +/- 10um | |
| – REPEATABILITY (bi-directional) | +/- 2um | ||
| THROUGHPUT | |||
| – “HANDS OFF” RUNTIME | Up to 8 hrs | ||
| – LINE WIDTH (single pass) | 10um – 2,000um | ||
| – LINE THICKNESS (single pass) | 0.1um – 5.0um | ||
| – SHUTTER SPEED | < 10ms | ||
| – PRINT SPEED (typ) – Ag nanoparticle ink – @ 1mm wide x 5.0um thick line | 4 mm/s | ||
| – PRINT SPEED (typ) – Ag nanoparticle ink – @ 100um wide x 3.0um thick line | 10mm/s | ||
| – PRINT SPEED (typ) – Ag nanoparticle ink – @ 10um wide x 1.0um thick line | 2mm/s | ||
| PRINTED MATERIALS | Typical Ranges | ||
| – VISCOSITY | 1-300 cPs | ||
| – PARTICLE SIZE | <0.2 um particles, somewhat larger flakes and nano-wires | ||
| – SURFACE TENSION | 10-73 Dyne/cm | ||
| – VAPOR PRESSURE | <55 mmHg | ||
| – CONDUCTORS | Nano-particle, flake, nanowire, precursor; Ag, Au, Cu and other metals, Carbon, PEDOT:PSS | ||
| – DIELECTRICS | 100% solids and dilute; Thermoset and UV cure; Polyimides, Acrylics, Epoxies, Fluoropolymers, Moisture barriers | ||
| – OTHER | CNTs, Graphine, Ceramics, Biomolecules, Transistors, Resistors, Sensors | ||
| FACILITY REQUIREMENTS | |||
| – POWER | 200-250 VAC single phase 50/60 HZ | ||
| – NITROGEN | 50 PSI@20 SLPM (MAX) | ||
| – DIMENSIONS | 46 x 60 x 86 in. (1168 x 1525 x 2185 mm) | ||
| – WEIGHT | 1250 LBS. (567 KG) | ||
KEWB Sequencer
Production grade machine interface software for development & process automation
Sequencer Software |
Allows process engineers to combine motion, vision and printing processes into seemless automated sequences. Different user access control levels for operators, Engineers & Maintenance eliminates possiblity of process tampering Cognex vision tools enable advanced vision aligment & pattern recognition Customizable alarms and data logging enable discrete monitoring of processes with closed feedback. Remove variability from your production process. Increase yield, decrease equipment down-time & user error |
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Printing 3D Interconnects & RDLs directly on die enabling next generation packaging
Package Level Shielding
Printing of conductive inks & pastes directly onto packaged die for shielding





