up3

Tiger Lake UP3 第 11 代 Intel® Core™ 處理器，在搭載我們第三代 10nm 製程技術的低功耗平臺中，實現了效能與回應能力的平衡。

Tiger Lake, COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3)

Jawbone UP3 智慧手環具備先進的多重感應器平台，內含全新三軸加速感應器、精密生物阻抗感應器，還有皮膚及環境溫度感應器。

Tiger Lake UP3 11th Gen Intel® Core™ processors deliver a balance of performance and responsiveness in a low-power platform built on our third-generation 10nm process technology.

艾訊全新3.5吋Intel® Tiger Lake-UP3嵌入式單板電腦CAPA55R將於2022年4月開始提供出貨服務；若需要更多的產品資訊、任何技術支援或報價，請參考艾訊台灣地區網站 www.axiomtek.com.tw。

3.5" SBC with Intel® Tiger Lake-UP3 for Fanless, Ultra Low-Power, High-Performance & Wide Temperature Solution

UP XTREME I11 EDGE ENABLING KIT 11th Generation Intel® Core™ i7/i5 Processor SoC (formerly Tiger Lake UP3) 11th generation Intel® Core™ i7/i5 Processor SoC (formerly Tiger Lake UP3) 16pin GPIO connector x 1 Pre-load Software Support 5G