The IEEE International Conference on Omni-Layer Intelligent Systems (COINS) unites researchers, engineers, system architects, and industry innovators to advance the science and technology of intelligent systems spanning hardware, software, and artificial intelligence. COINS provides a multidisciplinary forum for understanding, designing, and deploying next-generation intelligent technologies that extend from microarchitectures and circuits to large-scale autonomous and interconnected platforms. The conference emphasizes cross-layer co-design, energy-efficient and secure computing, AI-native systems and connectivity, and the responsible integration of intelligence across physical and digital environments. IEEE COINS encompasses the full continuum of intelligent system innovation, including AI-centric hardware and architectures, AI-native networking and edge intelligence, cloud and data-centric infrastructures, agentic and robotic autonomy, foundational and cognitive AI models, and human-aligned, ethical, and sustainable intelligence. It also highlights the transformative role of AI across diverse application and vertical domains—such as healthcare, manufacturing, energy, transportation, and urban infrastructure—where intelligent systems enable measurable societal and economic impact. Whether your focus is on enabling technologies, trustworthy deployment, or domain-driven applications, COINS offers a premier platform to exchange ideas, showcase innovations, and shape the future of intelligent, connected, and sustainable systems

Paper Submission Deadline: April 15, 2026