UV15RCL adhesive is a UV curable, optically clear compound that changes from red to clear once exposed to UV light. This distinctive feature gives users the confidence that penetration of UV light is taking place across the adhesive material, ensuring a thorough and effective curing process.*

What should engineers consider when choosing a low outgassing adhesive system for their application? The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. This is particularly true in the space industry, where the extreme environment of space can cause conventional adhesives to release volatile compounds. This ebook will equip you with information about the ASTM E595 standard, initially developed by NASA, that serves as a benchmark for assessing the outgassing characteristics of materials, as well as guide you through the adhesive selection process.

Two part epoxy system with paste consistency and remarkable cryogenic properties. Withstands rapid drop in temperature. Long working life. Low exotherm. Excellent resistance to acids, bases and many solvents. Outstanding electrical insulative properties. Service operating temperature range from 4K to +250°F.

The rise of electric vehicles and driver aids along with the proliferation of electronic sensors and safety features point towards continued growth in automotive electronics. Due to their lightweight, functional properties, adhesives, encapsulants and coatings will be of increased importance for use in structural bonding, as well as in non-structural applications for electronic, optical and mechanical components in electric vehicle manufacturing. Read more about the properties, uses and future developments of these compounds as they pertain to the automotive industry.

For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C. This dual cure process benefits a wide variety of bonding, coating, sealing and small encapsulation applications. Learn more about the advantages of dual cure adhesives and how they may enhance the performance properties required in your application.

Master Bond EP114 is a two-component nano silica filled epoxy system which offers excellent dimensional stability and a very high glass transition temperature (Tg >200°C upon curing. Its ultra-low initial mixed viscosity (500–1500 cps at room temperature) can be further reduced by preheating to a slightly higher temperature, making EP114 ideal for vacuum infiltration to produce dense nanocomposites, as shown in the case study below.

Die shear testing is vital to assess the reliability of the adhesive for surface mount and die attach applications. At Master Bond, our adhesives are analyzed by an independent lab for die shear strength. Testing is based on Mil-Std-883 Method 2019. The main objective of die shear testing is to evaluate the adhesive strength between a semiconductor die and the substrate of the package. In this test the force is applied in a perpendicular direction to the die edge, and parallel to the die attach or substrate plane.The compounds we used for testing are one component electrically conductive as well as non-conductive epoxy systems that have been designed for die attach applications and require heat for curing: Supreme 3HTND-2DA, EP3HTS-TC, EP3HTSDA-2, EP17HTDA-1, and EP17HTDA-2. Using a die size of roughly 2 x 2 mm (80 x 80 mil), the adhesives were applied and cured in accordance with their specifications. Results of the die shear test are indicated in the chart below.Die Shear Strength Testing ResultsDisclaimer: The findings in this article are not meant to be used for specification purposes.

Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver filled system, it exhibits high electrical conductivity (volume resistivity < 0.001 ohm-cm) and excellent thermal conductivity. This epoxy passes ISO 10993-5 for cytotoxicity and is designed for high-speed medical device manufacturing. EP3HTSDA-2Med cures quickly with heat. Cure schedule options include heating at 250°F for 20-30 minutes or 300°F for 5-10 minutes, with an optional post cure to optimize overall performance properties. The system bonds well to many substrates, including but not limited to metals, ceramics, plastics, and silicon dies. EP3HTSDA-2Med has an excellent physical strength profile. It provides a tensile strength of 3,000-4,000 psi and a tensile modulus of 200,000-250,000 psi. It has a thermal conductivity of 45-49 BTU•in/(ft2•hr•°F) [6.5-7 W/(m·K)]. The filler particles used in this epoxy are exceptionally small, averaging 2-3 microns, and no larger than 25 microns. This allows for very thin bond lines, thereby providing effective heat transfer since it can offer a very low thermal resistance of 2-3 x 10-6 K•m2/W. This epoxy resists many sterilization methods such as glutaraldehyde, ethylene oxide (EtO) and gamma radiation. The system is available in EFD® syringes for automated dispensing or glass jars in 20 grams, 50 grams, 100 grams, 1 pound and multiple pounds.

Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.

This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. From prototype to assembly line, our materials have aided in the success of many companies across the aerospace industry. This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. Our conformal coatings and potting/encapsulation compounds protect sensitive electronic parts against extreme conditions. Many of them meet rigorous industrial certifications including NASA low outgassing requirements.

In a report published in the US National Library of Medicine, National Institute of Health, regarding the use of a novel non-instrumental platform to enable a Loop Mediated isothermal Amplification (LAMP) based assay for Salmonella enterica, Master Bond EP31 is cited.

Selecting the right adhesive for space applications is extremely important, mainly due to the high vacuum (around 10-8 Torr) and the variation in temperatures. A key concern is the outgassing property of these adhesives. Any outgassing might lead to contamination of electronic or optical components, which can have a drastic impact on the optical properties of the system.Since outgassing is an important consideration in selecting the right adhesive for a space application, NASA and many other government agencies require these adhesives to pass the ASTM E-595 outgassing test. This test requires the total mass loss (TML) and collected volatile condensable materials (CVCM) to be less than 1% and 0.1%, respectively. TML is the weight of the product lost after an exposure to vacuum (less than 5 x 10-5) for 24 hours at 125°C. CVCM is the amount of volatiles which condense in a plate maintained at 25°C. Curing schedule also plays a vital role in achieving the best low outgassing properties.Apart from low outgassing, excellent resistance to temperatures over a wide range is a desired property for adhesives in space applications. Good performance at very low temperatures (around -110°F) is particularly important. Also of major significance for adhesives not sandwiched between two adherends is their capability of withstanding exposure to proton, electron and heavy ion types of radiation.Master Bond offers an extensive range of products which meet NASA low outgassing specifications combined with resistance to very low and high temperatures. Many of the low outgassing products offer optical clarity, thermal conductivity/electrical insulation, electrical conductivity and cryogenic serviceability.

Watch our on-demand webinar to learn how to optimize the adhesive selection process and ensure your medical device meets the highest standards. Explore published case studies that delve into the specific adhesive chemistries and application techniques used in successful medical device applications. Key Takeaways: Navigate the Complexities: Understand the factors to consider when choosing an adhesive, including service conditions, desired properties, and processing constraints Biocompatibility and Sterilization: Discover adhesives that meet rigorous biocompatibility (USP Class VI, ISO 10993-5) and sterilization requirements including resistance to autoclaving, ethylene oxide, and gamma radiation Real-world Success Stories: Results from case studies on five medical applications including battery sealing, biosensor wire bonding, and electrode encapsulation Case Studies Mentioned in the Webinar EP21LVMed: Used as a biocompatible sealant for a wireless optogenetic microsystem MasterSil 151Med Used in an Implantable Device for Electrical Nerve Stimulation EP42HT-2Med: Utilized in prosthetics and fully implantable medical devices EP3HTMed: Relative Biological Effectiveness of Alpha Radiation in Cultured Porcine Aortic Cells EP30Med: Utilized as Sensor Encapsulant in Prosthetic Device