Welcome to Dycotec Materials

DM-ENC-2500 is a screen printable encapsulation coating that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates. The paste is cured at temperatures between 120-180˚C.

Dycotec DM-SIP-3062S is a screen printable silver paste that is used for display and general printed electronics applications. The paste is compatible with glass and transparent conductive coated glass substrates.

Dycotec DM-SIP-3063S is a single part screen printable epoxy thermoset silver paste for general printed electronics application use. The paste is compatible with substrates such as PET, FR4, glass and polyimide and should be cured at 140˚C for 10 minutes or 185˚C for 1 minute.

DM-SIP-3064S is a flat-bed and rotary screen printable silver paste that is used for OPV thin film PV electrodes and general printed electronics applications. It is designed for specifically for compatibility with OPV.

Dycotec DM-SIP-3065S is a screen printable silver paste for use on polyimide and PET plastic substrates for general printed electronics applications.

DM-CAP-4311S is a single part screen printable carbon paste for general electronic application use. The paste should be cured at low temperature (140˚C) to achieve a sheet resistance of <30 Ω/□/25μm. It a thermoset product that provides good hardness (2H) and can be used for flexible printed electronic applications including use on PET substrates.

DM-CAP-4321S is a single part screen printable carbon paste for general electronic application use. The paste should be cured at low temperature (140˚C) to achieve a sheet resistance of <100 Ω/□/25µm ±10%. It a thermoset product that provides good hardness (3H) and can be used for flexible printed electronic applications including use on PET substrates.

DM-CAP-4331S is a single part screen printable carbon paste for general electronic application use. The paste should be cured at low temperature (140˚C) to achieve a sheet resistance of <1000 Ω/□/25μm ±10%. It a thermoset product that provides good hardness (3H) and can be used for flexible printed electronic applications including use on PET substrates.

DM-CAP-4511S is a thermoplastic carbon paste for flat-bed and R2R screen printing.

DM-OCI-6002 is a thermoset epoxy based UV curable ink-jet printable overcoat that offers excellent mechanical hardness for applications such as display, PV and OLED.

DM-GRA-9001 is an ink-jet printable few layer graphene conductive ink for applications such as sensors, heaters and barrier layers.

DM-GRA-9002 is a single layer graphene ink-jet printable conductive ink for applications such as sensors, heaters and barrier layers.

DM-GRA-9003 is a few layer graphene ink-jet printable conductive ink for applications such as sensors, heaters and barrier layers that can be processed at low temperature.

DM-GRA-9100S is a graphene-carbon hybrid paste for applications such as sensors, heaters and printed resistors that can be processed at low temperature.

DM-AS-10003 is a single part solvent free silver epoxy conductive adhesive paste that provides excellent adhesion. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as heaters, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that originate from thermal expansion differences between bonded surfaces.

Dycotec DM-ADH-11001S is a screen printable epoxy adhesive that is used for general printed electronics applications. The paste is also compatible with syringe application.

DM-INS-2501 is a screen printable insulator coating that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates. The paste is cured at temperatures between 80-140˚C. The paste can be used for multilayer or cross over structures.

DM-SAS-10010 is a silver polyurethane based stretchable conductive adhesive that is used for wearable and general printed electronics applications.

DM-SIP-14001S is a RoHS compliant mixed bonded solderable silver cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates like glass, circuits on steel eg heaters and certain ceramics. Typical applications include terminations for chip resistors, potentiometers and heaters.

DM-INS-14100 is an RoHS compliant insulating dielectric specifically designed for use on Ferritic 430 Stainless Steel grades. It is screen printed onto the substrate and should be fired in a conveyor furnace in an air oxidizing atmosphere. When fired, the dielectric gives a dense layer and consequently provides excellent breakdown voltage. It is typically used to form an insulating layer in heater applications.

DM-IN-7021S is a screen printed thermally cured Insulator paste that offers excellent mechanical hardness for applications such as sensors and multi-layer devices.

DM-SIP-14005S is a RoHS compliant mixed bonded solderable silver cermet paste. It is designed to be fired at low temperatures (525-700°C) and provides good adhesion to substrates such as float glass, enamel coatings and ceramics.

DM-SIP-14020S is an RoHS compliant mixed bonded solderable silver/platinum (1%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

DM-SIP-14021S is an RoHS compliant mixed bonded solderable silver/platinum (2%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

DM-CAP-2101S is a screen printable carbon paste that is used in stretchable applications such as wearable devices, sensors, heaters, elite sports and medical devices. The paste enables stretchability >200% and has a sheet resistance of 60Ω/□/25µm.

DM-CAP-2101SPU is a screen printable carbon paste that is used in stretchable applications such as wearable devices, sensors, heaters and medical devices. The paste enables stretchability >150% and has a sheet resistance of ~60 Ω/□/25µm. It is designed for use on TPU substrates.

DM-15203S is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 °C to fill interface voids and cavities to provide low thermal interface resistance by elimination of air filled gaps and improving heat transfer at the interface.

Dycotec Materials DM-INS-2520 is a screen printable insulator coating that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates. The paste is cured at temperatures between 120-150˚C.

DM-TIM-15025 is a one part, non-silicone high thermal conductivity gel/putty. The material is supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15025 is a one part, non-silicone high thermal conductivity gel/putty. The material is supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15035 is a one part, non-silicone high thermal conductivity gel/putty. The material is supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15025 is a one part, non-silicone high thermal conductivity gel/putty. The material is supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15045 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging option. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15045 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging option. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15055 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15055 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15055 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15065 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-AS-10003 is a single part solvent free silver epoxy conductive adhesive paste that provides excellent adhesion. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as heaters, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that originate from thermal expansion differences between bonded surfaces.

DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

DM-INS-14500 is an insulating dielectric specifically designed for use on austenitic 304 stainless steel. It is screen printed onto the substrate and should be fired in a conveyor furnace in an air oxidizing atmosphere. When fired, the dielectric gives a dense layer and consequently provides excellent breakdown voltage. It is typically used to form an insulating layer in heater applications.

DM-RES-14201 is an RoHS compliant cost effective silver resistor paste to be used as heating elements on ceramics and dielectric coated steel substrates.

DM-RES-14301 is an RoHS compliant low cost silver-platinum (<2.0%) resistor paste intended to be used as heating elements on ceramics and dielectric coated steel substrates.

DM-15204S is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 deg. C to fill interface voids and cavities to provide low thermal interface resistance by elimination of air filled gaps and improving heater transfer at the interface.

DM-SIP-14031S is an RoHS compliant mixed bonded solderable silver/palladium cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

DM-SIP-3028AS is a screen printable silver paste that is used for SPD (Suspended Particle Devices) and PDLC (Polymer Dispersed Liquid Crystals) for bus bar formation for smart glass applications. The ink is compatible with glass and transparent conductive coated glass substrates.

DM-SYP-3028AT is a syringe printable high viscosity silver ink that is used for PDLC (Polymer Dispersed Liquid Crystals) smart glass and general printed electronics applications. The ink is compatible with glass and transparent conductive coated glass substrates.

DM-TIM-15323-SYP is a high thermal conductivity single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.

DM-UFL-16001 is a two part flexible epoxy thermoset underfill that is syringe printed. It is designed for use as a capillary underfill for chip size packages and other electronic components.

DM-CAP-4402S is a single part screen printable carbon paste for ion selective electrode in printed biosensor manufacture. The paste is hydrophobic preventing water penetration which can otherwise cause unwanted capacitive effects resulting in sensor inaccuracy. For use with nitrate, potassium, calcium, sodium, magnesium, phosphate, ammonium and chloride ion concentration measurements when suitable ionophores are attached. Applications including; agriculture, marine farming, wearable and water purity sensors.

DM-INS-2512 is a screen printable encapsulation coating that is used in stretchable applications such as wearable devices, sensors and medical applications. The paste can be applied to elastomeric and textile substrates. The paste is cured at temperatures between 80-140˚C.

DM-SIP-3069 is a single part silver epoxy conductive screen printed paste for biosensor and electrochemical sensor manufacture. The paste can be used on flexible low temperature substrates such as paper and PET. The paste offers excellent robustness and is well suited for use with electrical connectors eg Zero-Insertion-Force (ZIF) sockets. It offers excellent durability and be used for sensors operating in hostile environments eg agriculture and marine farming.

DM-RES-14302 is an RoHS compliant low cost silver-platinum (<1.8 %) resistor paste intended to be used as heating elements on ceramics and dielectric coated steel substrates.

DM-RES-14402 is an RoHS compliant low cost silver-platinum (2.0 %) resistor paste intended to be used as heating elements on ceramics and dielectric coated steel substrates.

DM-TIM-15075 is a one part, non-silicone high thermal conductivity paste (7.5 W/m.K). The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15075 is a one part, non-silicone high thermal conductivity paste (7.5 W/m.K). The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15323-P is a high thermal conductivity single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.

DM-OC-6050S is a thermoset polymer protective overcoat for use with Dycotec’s range of the thick film resistor and conductor pastes for use on ceramic, stainless steel and PCB substrates. The paste acts as a protective coating, solder-dams and can also be used as a marking ink. The standard product is blue in colour but other colour are available on request.

DM-TIM-15085 is a one part, non-silicone high thermal conductivity paste (8.5 W/m.K). The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-TIM-15340 is a high thermal conductivity (3.7 W/m⋅K) single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.

Dycotec DM-CAI-4606 is a nanocarbon ink-jet printable ink that is used for general printed electronics applications such as sensors, heaters and solar cell. The ink offers good electrical conductivity at low curing temperatures (100oC). It can be used on Soda Lime Glass, ITO-glass, ITO-PET, PET, PI, PEEK and PEN substrates.

The ink is typically purchased as a kit, including 500g of flushing solution, DM-CLN-3000.

DM-INS-2514 is a screen printable encapsulation coating that is used in stretchable applications such as wearable devices, sensors and medical applications. The paste can be applied to elastomeric and textile substrates. The paste is cured at temperatures between 80-120˚C.

DM-CAP-4410S is a single part screen printable carbon paste for for printed biosensor manufacture. The paste provides a high sensitivity screen-printed electrode (SPE). Applications include electrochemical biosensors such as enzymatic/DNA sensors and immunosensors.

DM-OC-6400S is a single part screen printable overcoat paste for printing overcoat / insulator layers to protect the circuity of biosensors.

DM-RES-14401S is an RoHS compliant low cost silver-palladium (2.0 %) resistor paste intended to be used as heating elements on ceramics and dielectric coated steel substrates.

DM-SIP-3074S is a cost effective screen printable silver paste for flexible applications such as hybrid printed electronics. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (120-150ºC). It offers excellent electrical conductivity at low silver loading.

DM-TIM-15085 is a one part, non-silicone high thermal conductivity paste (8.5 W/m.K). The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

DM-CAP-4514S is a screen printable carbon paste system that can be used to manufacture flexible circuits or can be printed on silver conductive traces to improve durability of silver pads on flex circuit tails. It can also be blended with DM-SIP-3074S to create pastes with specific sheet resistances.

DM-CAP-2100S is a screen printable carbon paste that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates.

Dycotec Materials DM-SIP-2004 is a screen printable silver paste that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates and has excellent washability withstanding up to 50 wash cycles when used with Dycotec’s encapsulant pastes.

Dycotec Materials DM-SIP-2005 is a cost effective screen printable silver paste that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates and has good washability when used with Dycotec’s encapsulant pastes. It offers excellent electrical conductivity at low silver loading with maximum elongation of 60%.

Dycotec Materials DM-SIP-2005PU is a screen printable silver conductor paste that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to TPU(polyurethane) substrates. It offers excellent electrical conductivity and is stretchable up to 80%.

DM-SIP-2006 is a cost effective screen printable silver paste that is used in stretchable applications such as wearable devices, sensors and medical devices. It offers exceptional stretchability with maximum elongation of 170% and is cost effective with a low silver content. The paste can be applied to elastomeric and textile substrates and has good washability when used with Dycotec’s encapsulant pastes.

Screen Printed UV Cured translucent Insulator paste for flexible substrates

Screen Printed UV Cured translucent blue Insulator paste for flexible substrates

Screen Printed UV Cured translucent green Insulator paste for flexible substrates

RoHS and REACH compliant dielectric paste suitable for multilayer applications on alumina substrates. The paste fires into a non-porous, dense layer and may be used with Dycotec silver and gold conductor pastes.

Designed specifically for Perovskite Solar Cell use, DM-CAP-4702S is a thermoplastic carbon paste for screen printing and blade coating highly conductive electrode structures on perovskite solar cells. The paste allows fast drying at low temperature (<100˚C) forming a dense layer with a sheet resistance of <15 Ω/□/25μm.

DM-OC-6051S is a white coloured thermoset polymer protective overcoat for use with Dycotec’s range of the thick film resistor and conductor pastes for use on ceramic, stainless steel and PCB substrates. The paste acts as a protective coating, solder-dams and can also be used as a marking ink.