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Accurate and Efficient Non-Contact Inspection in a Broad Range of Implementations

Optical Metrology Applications
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VIEW metrology solutions measure critical dimensions in a wide variety of applications involving 2D micro-components and assemblies.  Compared to “walk up and measure” routines, VIEW systems are designed for continuous operation in automated production environments, with speeds that often help metrology teams achieve 100% inspection.

Advanced Packaging

Fan-out wafer-level packaging
Accurate and efficient non-contact inspection of fan-out wafer-level packaging with multiple levels of magnification
Flip chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements

Measurement of pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations 

RDL Layers

Redistribution Layer inspection involves examining the fine metal interconnects in advanced chip packages

Flexibility to rapidly measure a wide variety of aperture sizes, shapes, and positions

Critical Dimensional Measurement Systems

Wirebond Packaging

Measuring ball, tooling mark diameters, placement, pad alignment, & wire loop height
Leadframe inspection presents a wide variety of feature sizes and geometry

Coplanarity, lead width, pitch, ball diameter, package height and warpage inspection 

Semiconductor Tooling

Orifice diameter/position measurement accuracy of < 10 nm 

Testing the electrical viability of each individual chip before it is diced and packaged

Showerhead Inspection

Ensuring uniform material deposition by measuring hole diameter, roundness, and true position

Flexibility to rapidly measure a wide variety of aperture sizes, shapes, and positions

Meet performance standards and for high-volume manufacturing before they are integrated into final products.

Critical Dimensional Measurement Systems

PCB Inspection

Versatile lighting, large-size stages, high-resolution positioning
Measurement of critical features such as the positions of leads, pads, and warpage

A crucial height and volume measurements to new process development

Electronic Assembly Calibration & Monitoring

Measurement of positioning and rotation (X, Y, and Theta) relative to pads

Measuring the true position and pitch of each lead within large multi-lead arrays 

Metrology solutions for fiber optic interconnect components 

Quickly acquire data on connector positions, size, pitch, & coplanarity measurements 

Critical Dimensional Measurement Systems

Critical Dimensional Measurement Systems

Hard Disc Drive Component Metrology

Elevates Pinnacle performance to the next level
A large travel, high-accuracy dimensional measurement system
Offers exceptional linewidth and overlay measurement capability
Offers exceptional linewidth and overlay measurement capability
A large travel, high-accuracy dimensional measurement system

Critical Dimensional Measurement Systems

Precision Micro-Grinding

Metrology system high-resolution stage motion, quality optics, autofocus capabilities
Inspection of electrical test probes requires precision metrology capabilities to accurately measure small features

Extremely high levels of three-dimensional accuracy metrology systems 

Metrology application for process control and inspection of watch components

Critical Dimensional Measurement Systems

Critical Dimensional Measurement Systems

Custom Engineering

Application-specific fixturing, programming, interfaces to third party sensors & equipment

Integral to the inspection process with VMS 

Critical Dimensional Measurement Systems

VIEW system analyzes the pixels within the measurement window and builds a radial intensity profile of the circle

Ask us about a high-performance VIEW measurement system application study

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Diverse Applications

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VIEW Full Product Line

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