The EIC VentureMatch Programme invites investors and corporate partners to a high-level day connecting capital with Europe's most promising deep-tech companies. A confirmed cohort of 18 EIC-backed companies – selected by prominent jury members – will pitch across three sessions: semiconductors and advanced electronics; advanced manufacturing, robotics and materials; and advanced computing and AI. As an investor, you gain early access to curated, pre-vetted deal flow at the frontier of European technology, the chance to meet founders directly through structured matchmaking, and the opportunity to connect with leading co-investors from across Europe and beyond.
Meet the jury members:
- ETF Partners, Alice Chan
- OpenOcean. Adrien Levacic
- SET Ventures, Austin Wood
- Innovation Industries, Céline van der Heijden
- NXP Semiconductors, Fabian Faul
- Join Capital, Claudia Bonaccorsi
- Loom Ventures, Ilja Aizenberg
- Visionaries Tomorrow, Iris ten Have, PhD
- FORWARD.one, Julia Kuijs
- InvestNL DTF, Jurgen van Eck
- SHIFT Invest, Koen Hooning
- DCVC, Kristen Rocca
- Lakestar, Marc Alexander Kühn
- imec.xpand, Moritz Leander Müller
- MIG Capital, Oliver Kahl
- Extantia, Paola Brenni
- Fortino Ventures, Wouter Goossens
Companies pitching are:
AISPECO makes robotic sensor pods for digital twin data collection. Its gimbal technology allows its customers to fly three times faster and be 40% more efficient. Its modularity means customers use the same product from mineral exploration to utility inspection. The company was founded by surveyors and makes products for surveyors.
AEInnova is a deep-tech company specialising in energy harvesting and industrial IoT. The company develops thermoelectric systems that convert waste heat into power, enabling battery-free sensors and edge devices with integrated cloud platform for predictive maintenance in harsh industrial environments. Supports comes from the EIC Fund and EIT InnoEnergy.
BLIXT develops software-defined power infrastructure for electrical distribution and voltage conversion systems. Our programmable solid-state platform acts as an intelligent control layer for electricity, enabling real-time control, protection, conversion, visibility, and energy optimisation across industrial, utility, battery and AI-driven power.
Cerabyte revolutionises cold storage and active archives with its ‘Ceramic Nano-Memory’. Using femtosecond lasers to etch data onto nanometre-thin ceramic, it provides a sustainable solution lasting over 100 years. This immutable technology eliminates bit rot and dramatically reduces costs, ensuring permanent, eco-friendly access to the world’s most critical data.
Compular shortens the development of new materials using AI and simulations. The solution generates and optimises thousands of candidates in hours from objectives described in plain text. It also closes its own knowledge gaps by reading papers, running simulations automatically and learning from user measurements, creating a data flywheel.
ExpectedIT GmbH (Esslingen, Germany) develops and licenses LPool® semiconductor IP and a breakthrough rack-scale infrastructure architecture for AI, HPC and cloud workloads. LPool collapses an entire rack of CPUs into a single hardware-coherent host, eliminating the orchestration overhead that bottlenecks modern inference and HPC systems.
Golana Computing develops an industrial AI platform combining proprietary high-frequency sensors, existing machine data and advanced analytics to monitor critical equipment in real time. Its solution detects anomalies, predicts failures and optimises maintenance and process performance across manufacturing, energy and heavy industry.
Iktos is a French deep-tech company founded in 2016, pioneering AI and robotics for drug discovery. Its integrated platform combines generative AI (Makya), retrosynthesis AI (Spaya), and robotic synthesis to fully automate the design-make-test-analysis cycle.
inPhocal is a deep-tech scale-up transitioning into a commercially scalable industrial-technology company. It is the first to introduce a long-focus, multi-material laser platform for marking at extreme production speeds, with near-zero downtime. The system eliminates consumables and targets the global coding/marking and semiconductor markets.
Ligna Energy has pioneered the thinnest, greenest power solutions for connected devices – making its technology the most cost-effective enabling layer for the trillions of devices that are expected to come online over the next decade as AI computing moves to the edge.
Lotus Microsystems develops high-performance power modules for next-gen computing. The company’s proprietary silicon power interposer, power converters and advanced packaging achieve leading power density and thermal performance. Built on research from DTU, Harvard and IMEC, Lotus delivers scalable power solutions for AI, HPC and advanced electronic systems.
Mitiga is a climate risk intelligence company spun out of the Barcelona Supercomputing Center in 2018. Its over €40 million AI-powered climate risk platform combines climate science and high-performance computing to deliver climate risk projections, enabling infrastructure and financial services players to make data-driven decisions under a changing climate.
Quantum Dice is a quantum technology spin-out from the University of Oxford's world-renowned quantum optics lab that is developing the world's first scalable probabilistic processing unit (PPU) providing a 1,000-fold speed-up and 100-fold energy reduction for workloads in optimisation under uncertainty and in causal and explainable AI.
QuantaMap accelerates quantum chip R&D and improves chip manufacturing yield and consistency. The NAUTILUS platform combines AFM and SQUID quantum sensing to image key chip properties, invisible to other methods, on the nanoscale. QuantaMap enables non-invasive defect inspection and process control in the challenging operating conditions of quantum chips.
RiseTech develops next-generation electrochemical deposition equipment for semiconductor manufacturing. Its Dynamic Drop™ technology replaces conventional bath plating with thousands of localised, independently controlled electrochemical cells, enabling the precision and throughput required for advanced packaging and heterogeneous integration.
Spherical creates mission-specific chips and high-performance electronic systems for space, aerospace, defence and critical industries. Spherical controls the path from system requirements to silicon, using software and reusable IP to cut chip design from 18 months to under 1 month – making advanced silicon accessible to critical system builders.
This is a deep-tech physical AGI designed as a universal robot brain. It aims to provide one AI for all robots and all tasks. The system is robot-independent with full robot control, including trajectory and speed. It initially targets the automation of pick and place operations in warehouses, followed by industrial assembly in manufacturing environments. Over time, it expands to more complex tasks and multi-step reasoning. The end goal is artificial superintelligence.
Treble is building the simulation and data infrastructure for physical AI through sound. The platform enables companies to simulate real-world environments and generate synthetic data for multimodal AI, machine perception, voice AI, robotics and intelligent devices.
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