Home » Applications » Data Center ICs: Custom ESD and I/O Protection for High-Speed Compute and Connectivity

Data Center ICs: Custom ESD and I/O Protection for High-Speed Compute and Connectivity

Modern data centers are powered by ever-faster compute nodes and ultra-high-bandwidth interconnects. Whether used in AI training, cloud storage, or inference, these chips rely on thin-oxide transistors, advanced packaging, and low-voltage, high-speed interfaces.

The move to optical communication, even for rack-to-rack connections, introduces new challenges in ESD protection and signal integrity. At the same time, massive chips built on FinFET nodes must survive strict reliability and CDM stress limits.

Sofics provides custom ESD and I/O IP for data center SoCs, photonics modules, and compute accelerators, optimized for performance, power, and reliability.

Custom Requirements for Data Center SoCs

The demands of hyperscale and high-performance computing require protection strategies beyond what foundry standard cells can provide:

  • Low-parasitic capacitance for SerDes and PCIe
    Interfaces like PCIe, CXL, and SerDes links require ESD clamps that maintain high-speed signal integrity.
  • Sensitive FinFET transistors
    FinFET and advanced CMOS nodes used in data center SoCs require robust yet compact local ESD clamps to protect thin-oxide devices.
  • Large die size and high CDM stress
    AI accelerators and switch ASICs are among the largest chips produced. CDM protection must account for high peak current during transient discharge.
  • Low-voltage operation
    Many interfaces run below 1V. Sofics IP supports low-voltage domains and protects the most vulnerable circuits.
  • Optical communication modules
    Transceivers and silicon photonics ICs used for optical I/O benefit from low-leakage and low-capacitance ESD designs.

Sofics IP for Data Center Applications

Key Focus Areas

  • High-speed wired and optical I/O
    Low-capacitance ESD IP for wired and optical interfaces with minimal signal degradation.
  • Die-to-die and chiplet integration
    Protection for 2.5D and 3D interfaces used in chiplet architectures and advanced packaging.
  • Protection for thin-oxide transistors
    Compatible with the most sensitive nodes (FinFET 16nm, 12nm, 7nm, 5nm and beyond).
  • High CDM robustness for large chips
    Local, fast-response ESD clamps tailored to protect large-die SoCs with high CDM currents.

Process technology covered

Mainstream CMOS (130nm to 65nm)
Advanced CMOS (40nm to 22nm)
FinFET technology
SOI technology
BiCMOS technology

Foundries covered

TSMC
GlobalFoundries

Customer Applications in Data Center ICs

Sofics IP is integrated in high-end products for data center connectivity and compute:

  • Optical interconnects and silicon photonics modules
    Rack-to-rack and intra-rack communication now uses optical links, which benefit from Sofics’ low-cap ESD clamps.
    (>15 customers)
  • AI accelerators and compute SoCs
    Our IP protects the largest FinFET chips used in AI training and HPC, with tailored CDM solutions.
    (4 customers)
  • Chiplet-based data processors
    2.5D and 3D SoCs with die-to-die interfaces use compact Sofics clamps to ensure safe communication across microbumps.
  • Timing chips
    Accurate silicon based timing chips
Testimonial: Graphcore Colossus
  • AI accelerator on TSMC 16nm FinFET
  • 23.5B transistors – 800mm²
  • last minute CDM protection
Phil Horsfield, VP Silicon

“Sofics offered us flexibility with customization, a silicon proven portfolio and fast time to market. Within just a few weeks we went from first contact to contract to solution delivery.”

These are examples from many IP delivery projects. If you did not find the example you were looking for you should contact us (info@sofics.com) to discuss your application and requirements.

Further reading