Power modules are the building blocks for all high power converters, providing the mechanical, thermal, and electrical interfaces necessary to connect power semiconductor die (chips) to the outside world. Power modules vary in size, shape, and construction based upon power rating and application requirements. IGBT, MOSFETs, diodes, and thyristors are configured in a huge variety of circuit topologies using advanced packaging technologies. Since inventing the first electrically isolated power module in 1975, Semikron Danfoss continues to be a leader in power semiconductor packaging.

For more than 20 years, Semikron Danfoss’ intelligent integrated power modules – also known as SKiiP modules – have proven to be a reliable solution for electric energy conversion, offering a high level of integration in compact dimensions. Our expertise in power electronics is integrated into both our IPMs and gate drivers, ensuring optimal efficiency in line with the industry's shift towards maximizing the use of power electronics. For our drivers, this results in highly integrated features and more stringent design and material selection requirements in developing reliable IGBT driver electronics, to meet the highest requirements from the demanding applications.

Semikron Danfoss offers discrete (single) diodes and thyristors in three package styles: axial/leaded, stud, and capsule/disc. These three packages cover a wide current range from PCB-mounted designs to megawatt-class converters. Applications include battery chargers, welding equipment, rotating rectifiers for brushless generators, electroplating, freewheeling diodes, high-voltage rectifiers, electrostatic filters, and blocking diodes.