tag: Baya Systems

AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric
By Saurabh Gayen - 26 Mar, 2026 - Comments: 0

Recent industry trends, including the release of NVIDIA’s Rubin platform (developer.nvidia.com), point to a growing consensus that AI inference is reshaping data center architecture in a fundamental way. As inference workloads become dominant, the data center network is no longer just a communication layer between servers. It is increasingly part of a distributed memory and storage hierarchy,... » read more

Memory Wall Gets Higher
By Brian Bailey - 26 Mar, 2026 - Comments: 1

Key Takeaways An increasing percentage of the chip area is consumed by the same amount of SRAM for each node shrink. The problem is not limited to leading-edge AI, as it will eventually impact even small MCUs and MPUs. Architectural changes may be required. Stacking SRAM chiplets on logic is possible but expensive. SRAM is a vital piece of all computing systems, but its fail... » read more

Data Boom Puts Pressure On NoCs, Fabrics
By Liz Allan - 26 Mar, 2026 - Comments: 0

Key Takeaways: NoC challenges, such as wiring congestion, timing closure, and performance, must be considered in tandem with topology and placement. Topologies can be customized to meet an application’s specific data flow needs, with a system containing multiple topologies to suit different data or zones. What is challenging for one type of system, such as an SoC, switch, or AI chi... » read more

AI Won’t Kill Verification IP, But It Will Redefine It
By Ann Mutschler - 26 Mar, 2026 - Comments: 0

Key Takeaways AI will enhance, not replace, verification IP by automating test generation and debug. Verification IP’s core value will increasingly lie in trust, accountability, and system-level realism, especially as designs become more complex, multi-die, and security-sensitive. AI shifts verification bottlenecks from execution to specification quality, raising expectations for c... » read more

Chip Industry Week In Review
By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

AI Starting To Simplify Design Of Programmable Logic
By Liz Allan - 26 Feb, 2026 - Comments: 0

Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming is slower to benefit. FPGAs historically have been designed using Verilog or VHDL, but higher-level languages could push more intelligence into compilers. ML tools can also help with mixed-signal co-design by automatically tuning DSP algorithms based on analog simu... » read more

Can A Computer Science Student Be Taught To Design Hardware?
By Liz Allan - 17 Feb, 2026 - Comments: 2

Key Takeaways New approaches are being devised and tested to address the talent shortage. Leveraging AI in design tools will help engineers become more efficient, and potentially could reduce the time it takes to train engineering students. EDA companies are looking at whether it's possible to train computer science and software engineers to become hardware engineers. A vari... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected
By Liz Allan - 29 Jan, 2026 - Comments: 0

Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

Chip Industry Week in Review
By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S.  The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

Annual Global IC Fabs And Facilities Report
By Liz Allan - 07 Jan, 2026 - Comments: 0

Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

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