{"id":20310,"date":"2014-07-18T12:56:11","date_gmt":"2014-07-18T12:56:11","guid":{"rendered":"http:\/\/www.staging40.optomec.com\/?page_id=7368"},"modified":"2022-02-01T18:20:36","modified_gmt":"2022-02-01T18:20:36","slug":"semiconductor-packaging","status":"publish","type":"post","link":"https:\/\/optomec.com\/semiconductor-packaging\/","title":{"rendered":"Semiconductor Packaging"},"content":{"rendered":"<p><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"background-color: #ffffff;background-position: center center;background-repeat: no-repeat;padding-top:40px;padding-right:60px;padding-bottom:22px;padding-left:60px;margin-bottom: 0px;margin-top: 0px;border-width: 0px 0px 0px 0px;border-color:#eae9e9;border-style:solid;\" ><div class=\"fusion-builder-row fusion-row\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-one-full fusion-column-first fusion-column-last\" style=\"margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-sep-clear\"><\/div><div class=\"fusion-separator\" style=\"margin-left: auto;margin-right: auto;margin-bottom:20px;width:100%;max-width:40%;\"><div class=\"fusion-separator-border sep-single sep-solid\" style=\"border-color:#ffffff;border-top-width:1px;\"><\/div><\/div><div class=\"fusion-sep-clear\"><\/div><div class=\"fusion-text fusion-text-1\"><h2 style=\"text-align: center;\">Aerosol Jet can fine-print features as small as 20 microns to meet advanced packaging challenges.<\/h2>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_2 1_2 fusion-one-half fusion-column-first\" style=\"width:48%; margin-right: 4%;margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-1 fusion-sep-none fusion-title-text fusion-title-size-three\" style=\"margin-top:0px;margin-right:0px;margin-bottom:31px;margin-left:0px;\"><h3 class=\"title-heading-left\" style=\"margin:0;\">Features<\/h3><\/div><div class=\"fusion-text fusion-text-2\"><ul class=\"arrow\">\n<li>Features sizes ranging from ~10 microns to millimeters<\/li>\n<li>Dispensing support for wide variety of inks \/ materials<\/li>\n<li>Repeatable recipe driven dispense<\/li>\n<li>Planar and non-planar Capabilities<\/li>\n<li>Advanced vision and lighting control<\/li>\n<li>Low Temperature Processing<\/li>\n<li>CAD import eases toolpath generation<\/li>\n<\/ul>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-2 fusion_builder_column_1_2 1_2 fusion-one-half fusion-column-last\" style=\"width:48%;margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-3\"><p><img decoding=\"async\" class=\"aligncenter size-full wp-image-22 lazyload\" src=\"data:image\/gif;base64,R0lGODlhAQABAIAAAAAAAP\/\/\/yH5BAEAAAAALAAAAAABAAEAAAIBRAA7\" data-src=\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/03\/SemiconductorPCB.jpg\" alt=\"SemiconductorPCB\" width=\"250\" height=\"170\" \/><noscript><img decoding=\"async\" class=\"aligncenter size-full wp-image-22 lazyload\" src=\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/03\/SemiconductorPCB.jpg\" alt=\"SemiconductorPCB\" width=\"250\" height=\"170\" \/><\/noscript><br \/>\nSemiconductor Packaging<br \/>\nPrint die &amp; component attach, underfill and component encapsulation, and 3D interconnects which require feature sizes as small as 10 microns to millimeters.<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><\/div><\/div><div id=\"videos\"><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-2 nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"background-color: #ffffff;background-position: center center;background-repeat: no-repeat;padding-top:40px;padding-right:60px;padding-bottom:22px;padding-left:60px;margin-bottom: 0px;margin-top: 0px;border-width: 0px 0px 0px 0px;border-color:#eae9e9;border-style:solid;\" ><div class=\"fusion-builder-row fusion-row\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-3 fusion_builder_column_1_1 1_1 fusion-one-full fusion-column-first fusion-column-last\" style=\"margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-2 fusion-sep-none fusion-title-text fusion-title-size-three\" style=\"margin-top:0px;margin-right:0px;margin-bottom:31px;margin-left:0px;\"><h3 class=\"title-heading-left\" style=\"margin:0;\">3D Interconnects<\/h3><\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-4 fusion_builder_column_2_3 2_3 fusion-two-third fusion-column-first\" style=\"width:65.3333%; margin-right: 4%;margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-4\"><p>Aerosol Jet&#8217;s high-velocity dense mist stream enables the system to print vertically along the terraced steps of stacked dies without adjustment of Z-height positioning for eight to sixteen SiP die stacks. Typical 3D interconnects are 25 to 30 microns wide by 5+ microns in height. Total length of each interconnect is approximately 1.5 mm long with throughput for a single nozzle reaching up to 5,000 interconnects per hour. The Aerosol Jet print head is highly scalable supporting 2 or more nozzles at a time, pitch dependent, enabling 10,000 plus interconnects per hour. The solution is capable of extended print run times of four hours or more before ink refill is required.<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-5 fusion_builder_column_1_3 1_3 fusion-one-third fusion-column-last\" style=\"width:30.6666%;margin-top:0px;margin-bottom:20px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-5\"><p><script src=\"\/\/fast.wistia.com\/embed\/medias\/p2prs1rtgf.jsonp\" async><\/script><script src=\"\/\/fast.wistia.com\/assets\/external\/E-v1.js\" async><\/script><\/p>\n<div class=\"wistia_responsive_padding\" style=\"padding: 75.0% 0 0 0; position: relative;\">\n<div class=\"wistia_responsive_wrapper\" style=\"height: 100%; left: 0; position: absolute; top: 0; width: 100%;\">\n<div class=\"wistia_embed wistia_async_p2prs1rtgf videoFoam=true\" style=\"height: 100%; width: 100%;\"><\/div>\n<\/div>\n<\/div>\n<p>Printing 3D interconnects on stacked die<\/p>\n<\/div><div class=\"fusion-text fusion-text-6\"><p><em>For Stacked Die &amp; Other Complex Packaging Applications<\/em><\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-6 fusion_builder_column_1_1 1_1 fusion-one-full fusion-column-first fusion-column-last fusion-column-no-min-height\" style=\"margin-top:0px;margin-bottom:0px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-3 fusion-sep-none fusion-title-text fusion-title-size-three\" style=\"margin-top:0px;margin-right:0px;margin-bottom:31px;margin-left:0px;\"><h3 class=\"title-heading-left\" style=\"margin:0;\"><h2>Embedded Passives on Rigid &amp; Flex Substrates<\/h2><\/h3><\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-7 fusion_builder_column_2_3 2_3 fusion-two-third fusion-column-first fusion-column-no-min-height\" style=\"width:65.3333%; margin-right: 4%;margin-top:0px;margin-bottom:0px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-7\"><p>Aerosol Jet systems reliably produce ultra-fine feature circuitry well beyond the capabilities of thick-film and ink-jet processes. Most materials can be written with a resolution of down to 20 microns. For Ag, electronic features as small as 10 microns with a 20 micron pitch can be written. This capability offers a solution for the production of smaller, high performance components critical to size-sensitive applications like those in the wireless and hand-held device markets where component density is increasing dramatically.<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-8 fusion_builder_column_1_3 1_3 fusion-one-third fusion-column-last fusion-column-no-min-height\" style=\"width:30.6666%;margin-top:0px;margin-bottom:0px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-8\"><p><script src=\"\/\/fast.wistia.com\/embed\/medias\/vy5acz858i.jsonp\" async><\/script><script src=\"\/\/fast.wistia.com\/assets\/external\/E-v1.js\" async><\/script><\/p>\n<div class=\"wistia_responsive_padding\" style=\"padding: 75.0% 0 0 0; position: relative;\">\n<div class=\"wistia_responsive_wrapper\" style=\"height: 100%; left: 0; position: absolute; top: 0; width: 100%;\">\n<div class=\"wistia_embed wistia_async_vy5acz858i videoFoam=true\" style=\"height: 100%; width: 100%;\"><\/div>\n<\/div>\n<\/div>\n<p>Printed Resistors<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-9 fusion_builder_column_1_1 1_1 fusion-one-full fusion-column-first fusion-column-last fusion-column-no-min-height\" style=\"margin-top:0px;margin-bottom:0px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><div class=\"fusion-text fusion-text-9\"><p>The ability of the Aerosol Jet technology to create fine features with complex geometries in 3D from a wide range of materials makes it suitable for the production of both passive and active components, including resistors, inductors, capacitors, filters, micro-antennae, micro-batteries, and sensors. The precise edge definition and repeatability of the process are particularly relevant to high-frequency requirements. In comparison to screen-printing, embedded resistors can be made smaller and more accurately with the Aerosol Jet process, such that no laser-trimming is needed to tune the resistor to the right value.<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-10 fusion_builder_column_1_1 1_1 fusion-one-full fusion-column-first fusion-column-last fusion-column-no-min-height\" style=\"margin-top:0px;margin-bottom:0px;\"><div class=\"fusion-column-wrapper fusion-flex-column-wrapper-legacy\" style=\"background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;padding: 0px 0px 0px 0px;\"><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-4 fusion-sep-none fusion-title-text fusion-title-size-three\" style=\"margin-top:0px;margin-right:0px;margin-bottom:31px;margin-left:0px;\"><h3 class=\"title-heading-left\" style=\"margin:0;\">Component \/ Die Attach Applications<\/h3><\/div><div class=\"fusion-text fusion-text-10\"><p>As electronic component functionality increases and overall product package size decreases current dispense solutions are not keeping pace with manufacturing needs. With surface mount components as small as 0.60 mm X 0.30 mm and industry standard needle and jet dispense dot sizes &gt;0.15 mm, electrical shorting and time consuming material rework have become the norm for manufacturers driven by smaller product package sizes. The Aerosol Jet Series takes dispense functionality to a whole new level with its ability to dispense materials, such as conductive epoxies, with dot sizes as small as 50 microns. Aerosol Jet systems come equipped with a variety of print head options that enable feature sizes from 10 microns to millimeters in a single pass providing ultimate flexibility in meeting your dispense requirements.<\/p>\n<\/div><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-5 fusion-sep-none fusion-title-text fusion-title-size-three\" style=\"margin-top:0px;margin-right:0px;margin-bottom:31px;margin-left:0px;\"><h3 class=\"title-heading-left\" style=\"margin:0;\">Component Underfill and Encapsulation<\/h3><\/div><div class=\"fusion-text fusion-text-11\"><p>As component die and package size shrink with component-to-component spacing of 0.2 mm and requirements to be within 0.1 mm of the substrate surface, current dispense technologies are inhibiting manufacturers&#8217; ability to move to these new technologies.With capability of dispensing material such as epoxy to feature sizes of 50 microns, Aerosol Jet technology is capable of meeting today\u2019s and tomorrow\u2019s electronic packaging requirements. Aerosol Jet printer\u2019s continuous flow operation insures consistent material output over run times of 4 or more hours. With its built in shuttering capabilities excess material can be captured and recycled for future use. Couple these capabilities with the printer\u2019s ability to dispense precise thicknesses of materials for Underfill or Encapsulation applications, Optomec is leading the way in developing a new generation of environmentally friendly production solutions.<\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":19,"featured_media":8737,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[431,426],"tags":[],"class_list":["post-20310","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-aerosol-jet","category-applications"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v23.0 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Aerosol Jet for Semiconductor Packaging<\/title>\n<meta name=\"description\" content=\"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/optomec.com\/semiconductor-packaging\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Aerosol Jet for Semiconductor Packaging\" \/>\n<meta property=\"og:description\" content=\"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications\" \/>\n<meta property=\"og:url\" content=\"https:\/\/optomec.com\/semiconductor-packaging\/\" \/>\n<meta property=\"og:site_name\" content=\"Optomec\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/optomec\" \/>\n<meta property=\"article:published_time\" content=\"2014-07-18T12:56:11+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2022-02-01T18:20:36+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"849\" \/>\n\t<meta property=\"og:image:height\" content=\"335\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Bryan Germann\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Bryan Germann\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"10 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/\",\"url\":\"https:\/\/optomec.com\/semiconductor-packaging\/\",\"name\":\"Aerosol Jet for Semiconductor Packaging\",\"isPartOf\":{\"@id\":\"http:\/\/optomec.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg\",\"datePublished\":\"2014-07-18T12:56:11+00:00\",\"dateModified\":\"2022-02-01T18:20:36+00:00\",\"author\":{\"@id\":\"http:\/\/optomec.com\/#\/schema\/person\/c97592f3701b256df5f8f99516b90a85\"},\"description\":\"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications\",\"breadcrumb\":{\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/optomec.com\/semiconductor-packaging\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage\",\"url\":\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg\",\"contentUrl\":\"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg\",\"width\":849,\"height\":335},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/optomec.com\/semiconductor-packaging\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"http:\/\/optomec.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Semiconductor Packaging\"}]},{\"@type\":\"WebSite\",\"@id\":\"http:\/\/optomec.com\/#website\",\"url\":\"http:\/\/optomec.com\/\",\"name\":\"Optomec\",\"description\":\"3D PRINTING SOLUTIONS FOR AN ADDITIVE MANUFACTURING WORLD\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"http:\/\/optomec.com\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"http:\/\/optomec.com\/#\/schema\/person\/c97592f3701b256df5f8f99516b90a85\",\"name\":\"Bryan Germann\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"http:\/\/optomec.com\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/d090ae07c9c9b44d1a53937f64bb9217ca1f95fedd9cce2efc43b39a80f686c2?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/d090ae07c9c9b44d1a53937f64bb9217ca1f95fedd9cce2efc43b39a80f686c2?s=96&d=mm&r=g\",\"caption\":\"Bryan Germann\"},\"description\":\"As product manager for Optomec's Aerosol Jet family of 3D printed electronics solutions, Bryan guides the product development efforts and customer implementations, leveraging his background in mechanical engineering and experience working with sensors, materials research and additive manufacturing at GE Power Service.\",\"url\":\"https:\/\/optomec.com\/author\/bryan\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Aerosol Jet for Semiconductor Packaging","description":"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/optomec.com\/semiconductor-packaging\/","og_locale":"en_US","og_type":"article","og_title":"Aerosol Jet for Semiconductor Packaging","og_description":"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications","og_url":"https:\/\/optomec.com\/semiconductor-packaging\/","og_site_name":"Optomec","article_publisher":"https:\/\/www.facebook.com\/optomec","article_published_time":"2014-07-18T12:56:11+00:00","article_modified_time":"2022-02-01T18:20:36+00:00","og_image":[{"width":849,"height":335,"url":"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg","type":"image\/jpeg"}],"author":"Bryan Germann","twitter_misc":{"Written by":"Bryan Germann","Est. reading time":"10 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/optomec.com\/semiconductor-packaging\/","url":"https:\/\/optomec.com\/semiconductor-packaging\/","name":"Aerosol Jet for Semiconductor Packaging","isPartOf":{"@id":"http:\/\/optomec.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage"},"image":{"@id":"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage"},"thumbnailUrl":"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg","datePublished":"2014-07-18T12:56:11+00:00","dateModified":"2022-02-01T18:20:36+00:00","author":{"@id":"http:\/\/optomec.com\/#\/schema\/person\/c97592f3701b256df5f8f99516b90a85"},"description":"Aerosol Jet systems reliably produce ultra-fine feature circuitry for semiconductor packaging applications","breadcrumb":{"@id":"https:\/\/optomec.com\/semiconductor-packaging\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/optomec.com\/semiconductor-packaging\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/optomec.com\/semiconductor-packaging\/#primaryimage","url":"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg","contentUrl":"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg","width":849,"height":335},{"@type":"BreadcrumbList","@id":"https:\/\/optomec.com\/semiconductor-packaging\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"http:\/\/optomec.com\/"},{"@type":"ListItem","position":2,"name":"Semiconductor Packaging"}]},{"@type":"WebSite","@id":"http:\/\/optomec.com\/#website","url":"http:\/\/optomec.com\/","name":"Optomec","description":"3D PRINTING SOLUTIONS FOR AN ADDITIVE MANUFACTURING WORLD","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"http:\/\/optomec.com\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"en-US"},{"@type":"Person","@id":"http:\/\/optomec.com\/#\/schema\/person\/c97592f3701b256df5f8f99516b90a85","name":"Bryan Germann","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"http:\/\/optomec.com\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/d090ae07c9c9b44d1a53937f64bb9217ca1f95fedd9cce2efc43b39a80f686c2?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/d090ae07c9c9b44d1a53937f64bb9217ca1f95fedd9cce2efc43b39a80f686c2?s=96&d=mm&r=g","caption":"Bryan Germann"},"description":"As product manager for Optomec's Aerosol Jet family of 3D printed electronics solutions, Bryan guides the product development efforts and customer implementations, leveraging his background in mechanical engineering and experience working with sensors, materials research and additive manufacturing at GE Power Service.","url":"https:\/\/optomec.com\/author\/bryan\/"}]}},"featured_image_url":"https:\/\/optomec.com\/wp-content\/uploads\/2014\/07\/Circuit-board.jpg","_links":{"self":[{"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/posts\/20310","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/users\/19"}],"replies":[{"embeddable":true,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/comments?post=20310"}],"version-history":[{"count":3,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/posts\/20310\/revisions"}],"predecessor-version":[{"id":20560,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/posts\/20310\/revisions\/20560"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/media\/8737"}],"wp:attachment":[{"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/media?parent=20310"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/categories?post=20310"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/optomec.com\/wp-json\/wp\/v2\/tags?post=20310"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}