• a

  • Cleaning process using water-based (aqueous) solutions to remove contaminants from substrates, commonly used in batch or in-line spray systems or ultrasonic cleaning systems.
  • An azeotrope is a mixture of liquids that boils like a single pure liquid and does not change its composition when it boils. The vapor that boils off has the exact same chemical ratio as the liquid mixture. The azeotropic property is crucial for process stability, safety, and flammability, preventing separation and maintaining cleaning performance.

  • b

  • Batch immersion cleaning completely immerses the substrate to be cleaned so that the cleaning agent fully contacts every surface of the device. The process often incorporates either Ultrasonic energy or Spray-Under-Immersion (SUI) forces to circulate the fluid and apply mechanical energy to assist in the removal of contaminants.
  • Cleaning process typically performed off-line on small-scale surfaces or components requiring rework using solvents.

  • c

  • The process of determining the amount of cleaning agent dissolved in a given amount of solvent (usually water) to form the cleaning solution.
  • CoWoS (Chip-on-Wafer-on-Substrate) is an advanced semiconductor packaging method that places multiple chips side-by-side on a silicon base and connects them on a single substrate. This technique is essential for high-performance computing (HPC) and artificial intelligence (AI) chips, providing high-density interconnects, increased bandwidth, lower latency, and better power efficiency. CoWoS is designed to overcome the limitations of traditional packaging in terms of memory bandwidth and interposer capacity. It is widely used in high-end applications like GPUs, AI accelerators, FPGAs, and networking devices.
  • Cu Pillar (also known as Copper Pillar) is an advanced interconnect technology used in semiconductor packaging where small copper columns replace traditional solder bumps to connect a chip to a substrate. Cu pillars enable finer pitch, improved electrical performance, and better heat dissipation, making them ideal for high-density, high-performance devices.

  • d

  • A dendrite is a microscopic, tree-like filament that grows between biased conductive elements (like PCB traces or battery electrodes). They are caused by moisture and voltage, often resulting in leakage currents, device failures, and even fire hazards. On printed circuit boards, they cause electrical shorts, particularly between closely spaced components.
  • A quick process for measuring the surface energy of a material by applying a liquid of known surface tension to verify cleanliness and determine if a surface is ready for coating, bonding, or adhesion applications.

  • f

  • Flux is a substance that acts as a cleaner, removing absorbed gases, oxide films, and other impurities from metal surfaces, and reduces the surface tension of both the molten solder and the metal being soldered, enabling the solder to flow smoothly and adhere to the metal surface. During soldering, flux forms a protective layer over the material, preventing reoxidation of the surface at soldering temperatures.

  • i

  • In-line cleaning refers to a machine or method in which items move continuously on a conveyor belt through a wash, rinse, and dry stage. The speed of the conveyor controls how long parts are exposed to each stage.
  • Inorganic acid fluxes are active formulations that are often used to prepare heavily oxidized lead surfaces for applying hot solder dipped coatings.
  • Ion chromatography (IC) is an analytical tool for identifying harmful residues on circuit boards, separating ions and evaluating cleaning processes in electronics manufacturing.
  • A set of industry-defined guidelines for the design, manufacture, and assembly of electronics, particularly printed circuit boards (PCBs), created by the Association Connecting Electronics Industries (IPC), to ensure product quality, reliability, and consistency across the globe. They cover aspects like inspection, performance criteria, and acceptable soldering methods.
  • Also referred to as IPA, this organic polar molecule is a commonly used solvent for cleaning electronics and delicate surfaces due to its easy availability, low cost and quick evaporation.

  • m

  • Millipore Testing, also known as membrane filtration, is a method for evaluating the cleanliness of parts and fluids by filtering contaminants onto a special membrane filter. This process helps industries like automotive, aerospace, and electronics ensure quality and safety by quantifying solid particles that could cause failure.
  • Misprint cleaning in electronics is the process of removing solder paste or other materials from a printed circuit board (PCB) after a printing error occurs. Errors include applying solder paste to the wrong pads, applying too much paste, or applying paste in the wrong area. Misprints can be caused by clogged apertures, stencil misalignment, solder paste rheology shifts and other issues.

  • n

  • This flux formulation is designed to leave minimal nonactive residue after soldering, eliminating the need for post-solder cleaning in most cases or applications.

  • o

  • Flux containing organic acids and typically combined with other solvents like isopropyl alcohol and water. Also known as OA flux or water-soluble flux, these fluxes are stronger than rosin fluxes and clean the oxides off more quickly.
  • An organic solvent is a carbon-based liquid used to dissolve or disperse substances such as grease, oil and flux.

  • p

  • Panel Level Packaging (PLP) is an advanced semiconductor packaging technology that provides a cost-efficient, high-volume method for manufacturing electronic devices by utilizing large rectangular panels rather than traditional circular wafers.
  • Passivation is a process that makes the surface of metals less reactive and susceptible to rust and corrosion, without changing the material's appearance. It reduces the risk of production losses and extends part lifespan.
  • Pb-free refers to materials, components, or products, particularly in electronics, that contain less than 0.1% lead by weight. Also known as Lead-Free.
  • The process of removing contaminants, such as flux residues and other soils, from PCBs (Printed Circuit Boards). Typical cleaning processes involve a cleaning agent used with mechanical energy provided by manual benchtop cleaning or an automated cleaning system that may include spray, ultrasonic, batch immersion, or vapor degreasing.
  • Phosphating is a surface treatment process where a metal surface reacts with a phosphate solution in water. This reaction forms a tough layer of metal phosphates, which are not easily soluble. To do this, the material is cleaned with acid first, and then the phosphate layer is applied.
  • A printed circuit board (PCB) is an assembly platform where electronic components are mounted and interconnected through copper conductors. These conductors create electrical connections between components, forming a cohesive, working circuit that enables the functionality of the electronic device.

  • r

  • This flux formulation is a combination of rosin and solvent that is typically corrosion-resistant and best suited for clean and easy-to-solder surfaces.

  • s

  • Saponification is a chemical reaction where fats and oils react with an alkali to form soap and glycerol. The process plays a critical role in electronics cleaning by breaking down manufacturing residues like fluxes, making them easier to remove.
  • The component in a solution that other components are dissolved in. In the case of a solution composed of several liquids, the liquid present in the greatest quantity is usually referred to as the solvent.
  • Cleaning method that utilizes solvent to break down oils and other contaminants into smaller particles or dilute substances, and carry them into the solution for easy removal.
  • Spray-Under Immersion (SUI) involves immersing components in a cleaning bath and circulating the cleaning solution through nozzles located below the surface of the bath. This process creates a turbulence in the liquid, helping to loosen and remove contaminants from the part's surfaces, but is gentler than blasting it with high-pressure.
  • Process of removing solder paste or other residues from stencils used in electronics manufacturing to ensure accurate printing.

  • t

  • Tin whiskers are thin rod-like structures that grow from internal stresses in cooling solder joints. These microscopic structures can cause electrical shorts and pose risks of critical failures or fires in electronic assemblies and are a major reliability concern, especially in high-reliability systems like aerospace, medical equipment, and nuclear power.

  • u

  • Cleaning process that utilizes high-frequency sound waves transmitted through liquid to dislodge and remove contaminants and scrub clean the surface of immersed parts.
  • Understencil wipe process is designed specifically for the under-side cleaning of a stencil on a printer to remove excess solder paste or debris, ensuring quality soldering in electronics assembly.

  • v

  • A vacuum degreaser, also known as a vacuum vapor degreaser, is an airtight/airless degreaser that uses vacuum pressure to remove grease and contaminants from surfaces in industrial cleaning applications. Due to the enclosed process, it typically uses less chemistry, dries parts completely, and is better for the environment than traditional solvent cleaning methods.
  • A vacuum vapor degreaser, also known as a vacuum degreaser, is an airtight/airless degreaser that uses vacuum pressure to remove grease and contaminants from surfaces in industrial cleaning applications. Due to the enclosed process, it typically uses less chemistry, dries parts completely, and is better for the environment than traditional solvent cleaning methods.

  • w

  • A term commonly used to describe a soil or cleaning system where water is the primary cleaning agent.
  • Water-soluble flux includes solutions of active chemicals (usually proprietary solvent formulas) that are typically considered to be stronger and can deal with tarnishes more easily than rosin fluxes. Other names used to refer to this type of flux are: Organic Acid Flux and OA Flux