IC Decapsulation Services for Semiconductor Device Analysis

The internal structures of semiconductor devices are made visible by the IC decapsulation process so they may be examined and analyzed. To access the integrated circuits (ICs) within, it entails removing the protective encapsulating materials, such as plastic or ceramic packages. This method is frequently used in the reliability testing, failure analysis, and reverse engineering of semiconductor devices.

Talk to an Expert

IC Decapsulation Services for Semiconductor Device Analysis

TRUSTED BY

Precision-driven testing for dimensional accuracy and compliance

Overview
Scope, Applications, and Benefits
Test Process
Specifications
Instrumentation
Results and Deliverables

Overview

IC Decapsulation is a critical failure analysis and reverse engineering technique used to remove the protective packaging of semiconductor devices to expose the internal die and circuitry. This process allows detailed inspection of the chip structure, bonding wires, and internal defects without altering the core design.

It is widely used in electronics, semiconductor manufacturing, aerospace, and defense industries to investigate device failures, verify authenticity, and perform quality assessments. By enabling direct access to the die, decapsulation helps engineers identify issues such as manufacturing defects, corrosion, contamination, and electrical failures, ensuring product reliability and performance.

Scope, Applications, and Benefits

Scope

IC decapsulation involves controlled removal of encapsulating materials using chemical, thermal, or mechanical methods to expose the semiconductor die for analysis. It supports failure investigation, counterfeit detection, and design validation.

The scope includes:

Removal of epoxy or plastic packaging
Exposure of die and bond wires
Failure analysis and defect identification
Verification of internal structure
Support for quality and reliability studies

Applications

Semiconductor failure analysis
Counterfeit component detection
Quality control in electronics manufacturing
Aerospace and defense electronics testing
Research and development

Benefits

Enables direct inspection of internal structures
Identifies root causes of device failure
Supports authenticity verification
Improves product reliability
Assists in design and process improvements

Test Process

Sample Preparation

The IC is cleaned and mounted properly to ensure safe handling during decapsulation.

Encapsulation Removal

Chemical acids or mechanical methods are used to carefully remove the package without damaging the die.

Die Exposure

The internal chip, bond wires, and structures are exposed for inspection.

Analysis and Inspection

Microscopy and imaging techniques are used to examine defects and internal features.

Technical Specifications

Parameter	Details
Device Type	Integrated circuits (ICs), microchips, semiconductor packages
Decapsulation Methods	Chemical (acid etching), thermal, mechanical
Chemicals Used	Nitric acid, sulfuric acid (controlled conditions)
Parameters Controlled	Temperature, exposure time, acid concentration
Inspection Techniques	Optical microscopy, SEM, EDS
Failure Modes Identified	Corrosion, bond wire damage, cracks, contamination
Output	Exposed die and detailed analysis report

Instrumentation Used for Testing

Acid Decapsulation System
Hot Plate / Acid Jet Etcher
Optical Microscope
Scanning Electron Microscope (SEM)
Micro-manipulation Tools

Results and Deliverables

High-resolution images of die and bond wires
Identification of defects and failure modes
Root cause analysis report
Verification of device authenticity
Detailed technical report with findings

Frequently Asked Questions

IC decapsulation is the process of removing the outer packaging of a semiconductor device to expose the internal die for inspection and analysis.

It helps identify internal defects, verify component authenticity, and analyze failures that cannot be detected externally.

Strong acids like nitric and sulfuric acid are used under controlled conditions to dissolve encapsulation materials without damaging internal structures.

Most plastic-encapsulated ICs can be decapsulated, but ceramic packages may require different approaches.

Yes, if not properly controlled, the process can damage the die or bond wires, which is why precise control of temperature, chemicals, and exposure time is essential during decapsulation.

Why Choose Infinita Lab
for Electron Energy Loss
Spectroscopy (EELS)?

At the core of this breadth is our network of 2,000+ accredited labs in the USA, offering access to over 10,000 test types. From advanced metrology (SEM, TEM, RBS, XPS) to mechanical, dielectric, environmental, and standardized ASTM/ISO testing, we give clients unmatched flexibility, specialization, and scale. You are not limited by geography, facility, or methodology – Infinita connects you to the right testing, every time.