3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability. 3D PLUS products are used in high technology industries such as aerospace, defense, security and avionics. With more than 190,000 modules in space, and more than 22 years of flight heritage with no reported failure, we provide the global space and defense industry for all types of applications: telecommunications, Earth observation, navigation, launch and manned space vehicles, science missions and constellations. We offer a wide range of products including Memory and IP cores, Computer Cores, Interfaces, POL converters, Peripherals and Radiation Protection ICs, Camera heads and Custom System-In-Package (SiP) solutions.

3D PLUS products bring key advantages for our customers’ electronic designs:

          • High performance / high density / very high speed
          • High reliability / Rugged to extremely harsh environments and Space radiations
          • Extreme miniaturization / very small factor
          • Space qualification and very large flight heritage
          • Long term availability