Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP.

Heinrich Wolf Horst A. Gieser Dirk Walter Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP. 1476-1481 2009 49 Microelectron. Reliab. 12 https://doi.org/10.1016/j.microrel.2009.10.006 db/journals/mr/mr49.html#WolfGW09