Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Vincent Fiori

Perceval Coudrain Papa Momar Souare Rafael Prieto Vincent Fiori Alexis Farcy Laurent Le Pailleur Jean-Philippe Colonna Cristiano Santos Pascal Vivet M. Haykel Ben Jamaa Denis Dutoit François de Crecy Sylvain Dumas Christian Chancel Didier Lattard Séverine Cheramy Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. 21-36 2016 33 IEEE Des. Test 3 https://doi.org/10.1109/MDAT.2015.2506678 http://doi.ieeecomputersociety.org/10.1109/MDAT.2015.2506678 db/journals/dt/dt33.html#CoudrainSPFFLCS16

Giacomo Garegnani Vincent Fiori Gilles Gouget Frederic Monsieur Clément Tavernier Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. 90-96 2016 63 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2016.03.007 db/journals/mr/mr63.html#GaregnaniFGMT16

Benjamin Vianne Pierre Bar Vincent Fiori Sébastien Gallois-Garreignot Komi-Atchou Ewuame Pascal Chausse Stéphanie Escoubas Nicolas Hotellier Olivier Thomas Thermo-mechanical characterization of passive stress sensors in Si interposer. 738-746 2015 55 Microelectron. Reliab. 5 https://doi.org/10.1016/j.microrel.2015.02.005 db/journals/mr/mr55.html#VianneBFGECEHT15

Sébastien Gallois-Garreignot Naceur Benzima Etienne Benmussa Caroline Moutin Pierre-Olivier Bouchard Vincent Fiori Clément Tavernier Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. 980-989 2015 55 Microelectron. Reliab. 6 https://doi.org/10.1016/j.microrel.2015.03.008 db/journals/mr/mr55.html#Gallois-Garreignot15

Benjamin Vianne Alexis Farcy Vincent Fiori Cédrick Chappaz Norbert Chevrier G. Lobascio Pascal Chausse F. Ponthenier A. Ruckly Stéphanie Escoubas Olivier Thomas Stress management strategy to limit die curvature during silicon interposer integration. TS11.4.1-TS11.4.7 2015 3DIC https://doi.org/10.1109/3DIC.2015.7334622 conf/3dic/2015 db/conf/3dic/3dic2015.html#VianneFFCCLCPRE15

Vincent Fiori Komi-Atchou Ewuame Sébastien Gallois-Garreignot Hervé Jaouen Clément Tavernier Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. 764-772 2014 54 Microelectron. Reliab. 4 https://doi.org/10.1016/j.microrel.2013.12.022 db/journals/mr/mr54.html#FioriEGJT14

Cristiano Santos Papa Momar Souare François de Crecy Perceval Coudrain Jean-Philippe Colonna Pascal Vivet Andras Borbely Ricardo Reis 0001 M. Haykel Ben Jamaa Vincent Fiori Alexis Farcy Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 1-8 2014 3DIC https://doi.org/10.1109/3DIC.2014.7152167 conf/3dic/2014 db/conf/3dic/3dic2014.html#SantosSCCCVBRJF14

Vincent Fiori Sébastien Gallois-Garreignot Hervé Jaouen Clément Tavernier Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. 229-235 2013 53 Microelectron. Reliab. 2 https://doi.org/10.1016/j.microrel.2012.08.015 db/journals/mr/mr53.html#FioriGJT13

Papa Momar Souare François de Crecy Vincent Fiori M. Haykel Ben Jamaa Alexis Farcy Sébastien Gallois-Garreignot Andras Borbely Jean-Philippe Colonna Perceval Coudrain B. Giraud C. Laviron Séverine Cheramy Clément Tavernier Jean Michailos Thermal correlation between measurements and FEM simulations in 3D ICs. 1-6 2013 3DIC https://doi.org/10.1109/3DIC.2013.6702362 conf/3dic/2013 db/conf/3dic/3dic2013.html#SouareCFJFGBCCGLCTM13 Benjamin Vianne Pierre Bar Vincent Fiori Sebastien Petitdidier Norbert Chevrier Sébastien Gallois-Garreignot Alexis Farcy Pascal Chausse Stéphanie Escoubas Nicolas Hotellier Olivier Thomas Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 1-7 2013 3DIC https://doi.org/10.1109/3DIC.2013.6702332 conf/3dic/2013 db/conf/3dic/3dic2013.html#VianneBFPCGFCEHT13

Sébastien Gallois-Garreignot Vincent Fiori D. Nelias Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. 75-85 2010 50 Microelectron. Reliab. 1 https://doi.org/10.1016/j.microrel.2009.09.009 db/journals/mr/mr50.html#Gallois-GarreignotFN10

Pierre Bar Etienne Benmussa Naceur Benzima Andras Borbely Pierre-Olivier Bouchard Christian Chancel Cédrick Chappaz Pascal Chausse Séverine Cheramy Norbert Chevrier Jean-Philippe Colonna Perceval Coudrain François de Crecy Sylvain Dumas Denis Dutoit Stéphanie Escoubas Komi-Atchou Ewuame Alexis Farcy Sébastien Gallois-Garreignot Giacomo Garegnani B. Giraud Gilles Gouget Nicolas Hotellier M. Haykel Ben Jamaa Hervé Jaouen Didier Lattard C. Laviron Laurent Le-PailleurLaurent Le Pailleur G. Lobascio Jean Michailos Frederic Monsieur Caroline Moutin D. Nelias Sebastien Petitdidier F. Ponthenier Rafael Prieto Ricardo Augusto da Luz ReisRicardo Reis 0001 A. Ruckly Cristiano Santos Papa Momar Souare Clément Tavernier Olivier Thomas Benjamin Vianne Pascal Vivet