<?xml version="1.0"?>
<dblpperson name="S. Pommier" pid="65/8553" n="2">
<person key="homepages/65/8553" mdate="2010-09-28">
<author pid="65/8553">S. Pommier</author>
</person>
<r><article key="journals/mr/PietranicoLPBB11" mdate="2026-02-01">
<author pid="54/8553">S. Pietranico</author>
<author pid="15/3102">St&#233;phane Lefebvre</author>
<author orcid="0000-0001-7071-7259" pid="65/8553">S. Pommier</author>
<author pid="81/10630">M. Berkani Bouaroudj</author>
<author pid="87/2510">S. Bontemps</author>
<title>A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices.</title>
<pages>1824-1829</pages>
<year>2011</year>
<volume>51</volume>
<journal>Microelectron. Reliab.</journal>
<number>9-11</number>
<ee>https://doi.org/10.1016/j.microrel.2011.06.009</ee>
<url>db/journals/mr/mr51.html#PietranicoLPBB11</url>
</article>
</r>
<r><article key="journals/mr/PietranicoPLKB09" mdate="2020-02-22">
<author pid="54/8553">S. Pietranico</author>
<author pid="65/8553">S. Pommier</author>
<author pid="15/3102">St&#233;phane Lefebvre</author>
<author pid="79/8552">Zoubir Khatir</author>
<author pid="87/2510">S. Bontemps</author>
<title>Characterisation of power modules ceramic substrates for reliability aspects.</title>
<pages>1260-1266</pages>
<year>2009</year>
<volume>49</volume>
<journal>Microelectron. Reliab.</journal>
<number>9-11</number>
<ee>https://doi.org/10.1016/j.microrel.2009.06.026</ee>
<url>db/journals/mr/mr49.html#PietranicoPLKB09</url>
</article>
</r>
<coauthors n="5" nc="1">
<co c="0"><na f="b/Bontemps:S=" pid="87/2510">S. Bontemps</na></co>
<co c="0"><na f="b/Bouaroudj:M=_Berkani" pid="81/10630">M. Berkani Bouaroudj</na></co>
<co c="0"><na f="k/Khatir:Zoubir" pid="79/8552">Zoubir Khatir</na></co>
<co c="0"><na f="l/Lefebvre:St=eacute=phane" pid="15/3102">St&#233;phane Lefebvre</na></co>
<co c="0"><na f="p/Pietranico:S=" pid="54/8553">S. Pietranico</na></co>
</coauthors>
</dblpperson>

