Thermo-mechanical simulation of PCB with embedded components.

M. Brizoux

Wiyao Kpobie Marion Martiny Sebastien Mercier François Lechleiter Laurent Bodin Aurélien Lecavelier des Etangs-Levallois M. Brizoux Thermo-mechanical simulation of PCB with embedded components. 108-130 2016 65 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2016.08.016 db/journals/mr/mr65.html#KpobieMMLBEB16

B. Dompierre W. C. Maia Filho M. Brizoux Véronique Aubin Eric Charkaluk Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. 1661-1665 2010 50 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2010.07.125 db/journals/mr/mr50.html#DompierreFBAC10

W. C. Maia Filho M. Brizoux Hélène Frémont Yves Danto Torsion test applied for reballing and solder paste volume evaluation. 1663-1667 2007 47 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2007.07.028 db/journals/mr/mr47.html#FilhoBFD07

W. C. Maia Filho M. Brizoux Hélène Frémont Yves Danto Improved physical understanding of intermittent failure in continuous monitoring method. 1886-1891 2006 46 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2006.07.086 db/journals/mr/mr46.html#FilhoBFD06

Véronique Aubin Laurent Bodin Eric Charkaluk Yves Danto B. Dompierre Aurélien Lecavelier des Etangs-Levallois W. C. Maia Filho Hélène Frémont Wiyao Kpobie François Lechleiter Marion Martiny Sebastien Mercier