3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.

Maria-Luisa Calvo-Muñoz Christophe Dubarry Lucile Arnaud Maria-Luisa Calvo-Muñoz Gaëlle Mauguen Stéphane Moreau R. Crochemore Nicolas Bresson Bernard Aventurier 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 1-4 2021 3DIC https://doi.org/10.1109/3DIC52383.2021.9687599 conf/3dic/2021 db/conf/3dic/3dic2021.html#DubarryAMMMCBA21 Lucile Arnaud Bernard Aventurier Nicolas Bresson R. Crochemore Christophe Dubarry Gaëlle Mauguen Stéphane Moreau