Engineered SiC materials for power technologies.

Frank Fournel Walter Schwarzenbach S. Rouchier G. Berre R. Boulet O. Ledoux Enrica Cela Alexis Drouin A. Chapelle S. Monnoye H. Biard K. Alassaad L. Viravaux N. Ben Mohamed D. Radisson G. Picun G. Lavaitte A. Bouville-Lallart J. Roi J. Widiez K. Abadie E. Rolland Frank Fournel G. Gélineau F. Mazen A. Moulin C. Moulin D. Delprat N. Daval S. Odoul P. Sandri Christophe Maleville Engineered SiC materials for power technologies. 55-56 2022 ICICDT https://doi.org/10.1109/ICICDT56182.2022.9933092 conf/icicdt/2022 db/conf/icicdt/icicdt2022.html#SchwarzenbachRB22 Claire Besancon Delphine Néel Joan Ramirez David Bitauld Giancarlo Cerulo Dalila Make Nicolas Vaissiere Frédéric Pommereau Frank Fournel Loic Sanchez Cécilia Dupré Viviane Muffato Karim Hassan Jean Decobert AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs. 1-3 2021 OFC https://ieeexplore.ieee.org/document/9489662 conf/ofc/2021 db/conf/ofc/ofc2021.html#BesanconNRBCMVP21 C. Besancon Pierre Fanneau Delphine Néel Giancarlo Cerulo Nicolas Vaissiere Dalila Make Frédéric Pommereau Frank Fournel Cécilia Dupré T. Baron Jean Decobert Laser Array Covering 155 nm Wide Spectral Band Achieved by Selective Area Growth on Silicon Wafer. 1-4 2020 ECOC https://doi.org/10.1109/ECOC48923.2020.9333230 conf/ecoc/2020 db/conf/ecoc/ecoc2020.html#BesanconFNCVMPF20 Emilie Bourjot Paul Stewart Christophe Dubarry E. Lagoutte E. Rolland Nicolas Bresson G. Romano D. Scevola Viorel Balan Jérôme Dechamp Marc Zussy Gaëlle Mauguen Clément Castan Loïc Sanchez Amadine Jouve Frank Fournel Séverine Cheramy Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 1-5 2019 3DIC https://doi.org/10.1109/3DIC48104.2019.9058783 conf/3dic/2019 db/conf/3dic/3dic2019.html#BourjotSDLRBRSB19 Amadine Jouve Loïc Sanchez Clément Castan Nicolas Bresson Frank Fournel Nicolas Raynaud Pascal Metzger Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 1-7 2019 3DIC https://doi.org/10.1109/3DIC48104.2019.9058905 conf/3dic/2019 db/conf/3dic/3dic2019.html#JouveSCBFRM19 Lucile Arnaud Stéphane Moreau Amadine Jouve Imed Jani Didier Lattard Frank Fournel C. Euvrard Y. Exbrayat Viorel Balan Nicolas Bresson S. Lhostis J. Jourdon E. Deloffre S. Guillaumet Alexis Farcy Simon Gousseau M. Arnoux Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. 4 2018 IRPS https://doi.org/10.1109/IRPS.2018.8353591 conf/irps/2018 db/conf/irps/irps2018.html#ArnaudMJJLFEEBB18

H. Moriceau F. Rieutord Frank Fournel Léa Di Cioccio C. Moulet Luc Libralesso Pierric Gueguen Rachid Taibi C. Deguet Low temperature direct bonding: An attractive technique for heterostructures build-up. 331-341 2012 52 Microelectron. Reliab. 2 https://doi.org/10.1016/j.microrel.2011.08.004 db/journals/mr/mr52.html#MoriceauRFCMLGTD12

K. Abadie K. Alassaad Lucile Arnaud M. Arnoux Viorel Balan T. Baron G. Berre C. Besancon Claire Besancon H. Biard David Bitauld R. Boulet Emilie Bourjot A. Bouville-Lallart Nicolas Bresson Clément Castan Enrica Cela Giancarlo Cerulo A. Chapelle Séverine Cheramy Léa Di Cioccio N. Daval Jérôme Dechamp Jean Decobert C. Deguet E. Deloffre D. Delprat Alexis Drouin Christophe Dubarry Cécilia Dupré C. Euvrard Y. Exbrayat Pierre Fanneau Alexis Farcy G. Gélineau Simon Gousseau Pierric Gueguen S. Guillaumet Karim Hassan Imed Jani J. Jourdon Amadine Jouve E. Lagoutte Didier Lattard G. Lavaitte O. Ledoux S. Lhostis Luc Libralesso Dalila Make Christophe Maleville Gaëlle Mauguen F. Mazen Pascal Metzger N. Ben Mohamed S. Monnoye Stéphane Moreau H. Moriceau C. Moulet A. Moulin C. Moulin Viviane Muffato Delphine Néel S. Odoul G. Picun Frédéric Pommereau D. Radisson Joan Ramirez Nicolas Raynaud F. Rieutord J. Roi E. Rolland G. Romano S. Rouchier Loïc SanchezLoic Sanchez P. Sandri D. Scevola Walter Schwarzenbach Paul Stewart Rachid Taibi Nicolas Vaissiere L. Viravaux J. Widiez Marc Zussy