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<author pid="293/0475">Nicolas Bresson</author>
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<r><inproceedings key="conf/3dic/DubarryAMMMCBA21" mdate="2025-03-03">
<author orcid="0000-0002-6604-2997" pid="263/0942">Christophe Dubarry</author>
<author pid="159/3100">Lucile Arnaud</author>
<author orcid="0009-0002-1194-1669" pid="313/9328">Maria-Luisa Calvo-Mu&#241;oz</author>
<author pid="293/0816">Ga&#235;lle Mauguen</author>
<author pid="156/2680">St&#233;phane Moreau</author>
<author pid="313/9405">R. Crochemore</author>
<author pid="293/0475">Nicolas Bresson</author>
<author pid="93/8794">Bernard Aventurier</author>
<title>3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.</title>
<pages>1-4</pages>
<year>2021</year>
<booktitle>3DIC</booktitle>
<ee>https://doi.org/10.1109/3DIC52383.2021.9687599</ee>
<crossref>conf/3dic/2021</crossref>
<url>db/conf/3dic/3dic2021.html#DubarryAMMMCBA21</url>
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<r><inproceedings key="conf/3dic/BourjotSDLRBRSB19" mdate="2025-03-03">
<author pid="293/0411">Emilie Bourjot</author>
<author pid="40/1824">Paul Stewart</author>
<author orcid="0000-0002-6604-2997" pid="263/0942">Christophe Dubarry</author>
<author pid="263/0949">E. Lagoutte</author>
<author pid="168/7232">E. Rolland</author>
<author pid="293/0475">Nicolas Bresson</author>
<author pid="58/3931">G. Romano</author>
<author pid="263/0948">D. Scevola</author>
<author pid="293/0666">Viorel Balan</author>
<author pid="58/7962">J&#233;r&#244;me Dechamp</author>
<author pid="99/7961">Marc Zussy</author>
<author pid="293/0816">Ga&#235;lle Mauguen</author>
<author pid="293/0736">Cl&#233;ment Castan</author>
<author pid="03/9852">Lo&#239;c Sanchez</author>
<author pid="61/7962">Amadine Jouve</author>
<author orcid="0000-0001-6051-3391" pid="293/0602">Frank Fournel</author>
<author pid="63/7962">S&#233;verine Cheramy</author>
<title>Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.</title>
<pages>1-5</pages>
<year>2019</year>
<booktitle>3DIC</booktitle>
<ee>https://doi.org/10.1109/3DIC48104.2019.9058783</ee>
<crossref>conf/3dic/2019</crossref>
<url>db/conf/3dic/3dic2019.html#BourjotSDLRBRSB19</url>
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<r><inproceedings key="conf/3dic/JouveSCBFRM19" mdate="2025-03-03">
<author pid="61/7962">Amadine Jouve</author>
<author pid="03/9852">Lo&#239;c Sanchez</author>
<author pid="293/0736">Cl&#233;ment Castan</author>
<author pid="293/0475">Nicolas Bresson</author>
<author orcid="0000-0001-6051-3391" pid="293/0602">Frank Fournel</author>
<author pid="293/0398">Nicolas Raynaud</author>
<author pid="293/0128">Pascal Metzger</author>
<title>Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.</title>
<pages>1-7</pages>
<year>2019</year>
<booktitle>3DIC</booktitle>
<ee>https://doi.org/10.1109/3DIC48104.2019.9058905</ee>
<crossref>conf/3dic/2019</crossref>
<url>db/conf/3dic/3dic2019.html#JouveSCBFRM19</url>
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<r><inproceedings key="conf/irps/ArnaudMJJLFEEBB18" mdate="2025-12-14">
<author pid="159/3100">Lucile Arnaud</author>
<author orcid="0000-0001-6104-2050" pid="156/2680">St&#233;phane Moreau</author>
<author pid="61/7962">Amadine Jouve</author>
<author pid="204/5613">Imed Jani</author>
<author pid="15/4939">Didier Lattard</author>
<author orcid="0000-0001-6051-3391" pid="293/0602">Frank Fournel</author>
<author pid="24/10013">C. Euvrard</author>
<author pid="233/9404">Y. Exbrayat</author>
<author pid="293/0666">Viorel Balan</author>
<author pid="293/0475">Nicolas Bresson</author>
<author pid="62/4595">S. Lhostis</author>
<author pid="233/9363">J. Jourdon</author>
<author pid="43/6138">E. Deloffre</author>
<author pid="233/9765">S. Guillaumet</author>
<author pid="29/2715">Alexis Farcy</author>
<author pid="166/9890">Simon Gousseau</author>
<author pid="85/4573">M. Arnoux</author>
<title>Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.</title>
<pages>4</pages>
<year>2018</year>
<booktitle>IRPS</booktitle>
<ee>https://doi.org/10.1109/IRPS.2018.8353591</ee>
<crossref>conf/irps/2018</crossref>
<url>db/conf/irps/irps2018.html#ArnaudMJJLFEEBB18</url>
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<r><inproceedings key="conf/3dic/LattardAGBBSJJM16" mdate="2023-03-21">
<author pid="15/4939">Didier Lattard</author>
<author pid="159/3100">Lucile Arnaud</author>
<author pid="139/3489">Arnaud Garnier</author>
<author pid="293/0475">Nicolas Bresson</author>
<author pid="171/6074">Franck Bana</author>
<author pid="202/8823">R. Segaud</author>
<author pid="61/7962">Amadine Jouve</author>
<author pid="202/8840">H. Jacquinot</author>
<author orcid="0000-0001-6104-2050" pid="156/2680">St&#233;phane Moreau</author>
<author pid="179/9341">Karim Azizi-Mourier</author>
<author pid="139/6397">C. Chantre</author>
<author pid="13/6934">Pascal Vivet</author>
<author orcid="0000-0003-0539-7185" pid="21/9429">Ga&#235;l Pillonnet</author>
<author pid="202/8839">F. Casset</author>
<author pid="171/5829">F. Ponthenier</author>
<author pid="29/2715">Alexis Farcy</author>
<author pid="62/4595">S. Lhostis</author>
<author pid="118/1644">Jean Michailos</author>
<author pid="156/6765">Alexandre Arriordaz</author>
<author pid="63/7962">S&#233;verine Cheramy</author>
<title>ITAC: A complete 3D integration test platform.</title>
<pages>1-4</pages>
<year>2016</year>
<booktitle>3DIC</booktitle>
<ee>https://doi.org/10.1109/3DIC.2016.7970012</ee>
<crossref>conf/3dic/2016</crossref>
<url>db/conf/3dic/3dic2016.html#LattardAGBBSJJM16</url>
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<co c="0"><na f="a/Arnoux:M=" pid="85/4573">M. Arnoux</na></co>
<co c="0"><na f="a/Arriordaz:Alexandre" pid="156/6765">Alexandre Arriordaz</na></co>
<co c="0"><na f="a/Aventurier:Bernard" pid="93/8794">Bernard Aventurier</na></co>
<co c="0"><na f="a/Azizi=Mourier:Karim" pid="179/9341">Karim Azizi-Mourier</na></co>
<co c="0"><na f="b/Balan:Viorel" pid="293/0666">Viorel Balan</na></co>
<co c="0"><na f="b/Bana:Franck" pid="171/6074">Franck Bana</na></co>
<co c="0"><na f="b/Bourjot:Emilie" pid="293/0411">Emilie Bourjot</na></co>
<co c="0"><na f="c/Calvo=Mu=ntilde=oz:Maria=Luisa" pid="313/9328">Maria-Luisa Calvo-Mu&#241;oz</na></co>
<co c="0"><na f="c/Casset:F=" pid="202/8839">F. Casset</na></co>
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<co c="0"><na f="c/Cheramy:S=eacute=verine" pid="63/7962">S&#233;verine Cheramy</na></co>
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<co c="0"><na f="d/Dechamp:J=eacute=r=ocirc=me" pid="58/7962">J&#233;r&#244;me Dechamp</na></co>
<co c="0"><na f="d/Deloffre:E=" pid="43/6138">E. Deloffre</na></co>
<co c="0"><na f="d/Dubarry:Christophe" pid="263/0942">Christophe Dubarry</na></co>
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<co c="0"><na f="m/Metzger:Pascal" pid="293/0128">Pascal Metzger</na></co>
<co c="0"><na f="m/Michailos:Jean" pid="118/1644">Jean Michailos</na></co>
<co c="0"><na f="m/Moreau:St=eacute=phane" pid="156/2680">St&#233;phane Moreau</na></co>
<co c="0"><na f="p/Pillonnet:Ga=euml=l" pid="21/9429">Ga&#235;l Pillonnet</na></co>
<co c="0"><na f="p/Ponthenier:F=" pid="171/5829">F. Ponthenier</na></co>
<co c="0"><na f="r/Raynaud:Nicolas" pid="293/0398">Nicolas Raynaud</na></co>
<co c="0"><na f="r/Rolland:E=" pid="168/7232">E. Rolland</na></co>
<co c="0"><na f="r/Romano:G=" pid="58/3931">G. Romano</na></co>
<co c="0"><na f="s/Sanchez:Lo=iuml=c" pid="03/9852">Lo&#239;c Sanchez</na></co>
<co c="0"><na f="s/Scevola:D=" pid="263/0948">D. Scevola</na></co>
<co c="0"><na f="s/Segaud:R=" pid="202/8823">R. Segaud</na></co>
<co c="0"><na f="s/Stewart:Paul" pid="40/1824">Paul Stewart</na></co>
<co c="0"><na f="v/Vivet:Pascal" pid="13/6934">Pascal Vivet</na></co>
<co c="0"><na f="z/Zussy:Marc" pid="99/7961">Marc Zussy</na></co>
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