Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability.

Yves Ousten

M. Balmont Isabelle Bord-Majek B. Poupard Laurent Béchou Yves Ousten Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. 1108-1112 2018 88-90 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2018.06.077 db/journals/mr/mr88.html#BalmontBPBO18

Zaineb Jebri Isabelle Bord-Majek Celine Delafosse Christophe Pasquet Yves Ousten A new non-magnetic trimmer for the magnetic resonance imaging system. 1-5 2018 MOCAST https://doi.org/10.1109/MOCAST.2018.8376605 conf/mocast/2018 db/conf/mocast/mocast2018.html#JebriBDPO18

Raphael Baillot Yannick Deshayes Yves Ousten Laurent Béchou Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage. 1759-1764 2015 55 Microelectron. Reliab. 9-10 https://doi.org/10.1016/j.microrel.2015.06.145 db/journals/mr/mr55.html#BaillotDOB15

Walide Chenniki Isabelle Bord-Majek Mélanie Louarn Vincent Gaud Jean-Luc Diot Komkrisd Wongtimnoi Yves Ousten Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability. 2793-2798 2015 55 Microelectron. Reliab. 12 https://doi.org/10.1016/j.microrel.2015.06.057 db/journals/mr/mr55.html#ChennikiBLGDWO15

Amadou Sow Sinivassane Somaya Yves Ousten Jean-Michel Vinassa Fanny Patoureaux Power MOSFET active power cycling for medical system reliability assessment. 1697-1702 2013 53 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2013.07.096 db/journals/mr/mr53.html#SowSOVP13

Piero Spezzigu Laurent Béchou Gianandrea Quadri Olivier Gilard Yves Ousten Massimo Vanzi An original DoE-based tool for silicon photodetectors EoL estimation in space environments. 1999-2003 2011 51 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2011.07.036 db/journals/mr/mr51.html#SpezziguBQGOV11

Raphael Baillot Yannick Deshayes Laurent Béchou T. Buffeteau I. Pianet C. Armand F. Voillot S. Sorieul Yves Ousten Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses. 1568-1573 2010 50 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2010.07.056 db/journals/mr/mr50.html#BaillotDBBPAVSO10

M. L. Bourqui Laurent Béchou Olivier Gilard Yannick Deshayes Pamela Del Vecchio L. S. How F. Rosala Yves Ousten André Touboul Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications. 1202-1207 2008 48 Microelectron. Reliab. 8-9 https://doi.org/10.1016/j.microrel.2008.07.012 db/journals/mr/mr48.html#BourquiBGDVHROT08

Yannick Deshayes Isabelle Bord-Majek G. Barreau M. Aiche Philippe Moretto Laurent Béchou A. C. Roehrig Yves Ousten Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation. 1354-1360 2008 48 Microelectron. Reliab. 8-9 https://doi.org/10.1016/j.microrel.2008.06.044 db/journals/mr/mr48.html#DeshayesBBAMBRO08

Jean Augereau Yves Ousten Bruno Levrier Laurent Béchou Use of signal processing imaging for the study of a 3D package in harsh environment. 1922-1925 2006 46 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2006.07.081 db/journals/mr/mr46.html#AugereauOLB06

V. Krieger Wolfgang Wondrak A. Dehbi W. Bartel Yves Ousten Bruno Levrier Defect detection in multilayer ceramic capacitors. 1926-1931 2006 46 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2006.07.082 db/journals/mr/mr46.html#KriegerWDBOL06

H. A. Post P. Letullier T. Briolat R. Humke R. Schuhmann K. Saarinen W. Werner Yves Ousten G. Lekens A. Dehbi Failure mechanisms and qualification testing of passive components. 1626-1632 2005 45 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2005.07.085 db/journals/mr/mr45.html#PostLBHSSWOLD05

A. Dehbi Yves Ousten Yves Danto Wolfgang Wondrak Vibration lifetime modelling of PCB assemblies using steinberg model. 1658-1661 2005 45 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2005.07.074 db/journals/mr/mr45.html#DehbiODW05

Geneviève Duchamp Frédéric Verdier Yannick Deshayes François Marc Yves Ousten Yves Danto Reliability of Low-Cost PCB Interconnections for Telecommunication Applications. 1299-1304 2004 44 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2004.07.013 db/journals/mr/mr44.html#DuchampVDMOD04

G. Andriamonje Vincent Pouget Yves Ousten Dean Lewis Yves Danto Jean-Michel Rampnoux Younès Ezzahri Stefan Dilhaire Stéphane Grauby Wilfrid Claeys Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits. 1803-1807 2003 43 Microelectron. Reliab. 9-11 https://doi.org/10.1016/S0026-2714(03)00307-X db/journals/mr/mr43.html#AndriamonjePOLDREDGC03

Laurent Béchou Dominique Dallet Yves Danto Pasquale Daponte Yves Ousten Sergio Rapuano An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy. 135-142 2003 52 IEEE Trans. Instrum. Meas. 1 https://doi.org/10.1109/TIM.2003.809071 db/journals/tim/tim52.html#BechouDDDOR03

A. Dehbi Wolfgang Wondrak Yves Ousten Yves Danto High temperature reliability testing of aluminum and tantalum electrolytic capacitors. 835-840 2002 42 Microelectron. Reliab. 6 https://doi.org/10.1016/S0026-2714(02)00021-5 db/journals/mr/mr42.html#DehbiWOD02

B. Trégon Yves Ousten Yves Danto Laurent Béchou Bernard Parmentier Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions. 1113-1120 2002 42 Microelectron. Reliab. 7 https://doi.org/10.1016/S0026-2714(02)00046-X db/journals/mr/mr42.html#TregonODBP02

Jean Augereau Yves Ousten Laurent Béchou Yves Danto Acoustic analysis of an assembly: Structural identification by signal processing (wavelets). 1517-1522 2002 42 Microelectron. Reliab. 9-11 https://doi.org/10.1016/S0026-2714(02)00182-8 db/journals/mr/mr42.html#AugereauOBD02

Geneviève Duchamp Yves Ousten Yves Danto Evaluation of a micropackaging analysis technique by highfrequency microwaves. 1551-1554 2002 42 Microelectron. Reliab. 9-11 https://doi.org/10.1016/S0026-2714(02)00188-9 db/journals/mr/mr42.html#DuchampOD02

M. Aiche G. Andriamonje C. Armand Jean Augereau Raphael Baillot M. Balmont G. Barreau W. Bartel Laurent Béchou Isabelle Bord-Majek M. L. Bourqui T. Briolat T. Buffeteau Walide Chenniki Wilfrid Claeys Dominique Dallet Yves Danto Pasquale Daponte A. Dehbi Celine Delafosse Yannick Deshayes Stefan Dilhaire Jean-Luc Diot Geneviève Duchamp Younès Ezzahri Vincent Gaud Olivier Gilard Stéphane Grauby L. S. How R. Humke Zaineb Jebri V. Krieger G. Lekens P. Letullier Bruno Levrier Dean Lewis Mélanie Louarn François Marc Philippe Moretto Bernard Parmentier Christophe Pasquet Fanny Patoureaux I. Pianet H. A. Post Vincent Pouget B. Poupard Gianandrea Quadri Jean-Michel Rampnoux Sergio Rapuano A. C. Roehrig F. Rosala K. Saarinen R. Schuhmann Sinivassane Somaya S. Sorieul Amadou Sow Piero Spezzigu André Touboul B. Trégon Massimo Vanzi Pamela Del Vecchio Frédéric Verdier Jean-Michel Vinassa F. Voillot W. Werner Wolfgang Wondrak Komkrisd Wongtimnoi