Y. Exbrayat
Lucile Arnaud
Stéphane Moreau
Amadine Jouve
Imed Jani
Didier Lattard
Frank Fournel
C. Euvrard
Y. Exbrayat
Viorel Balan
Nicolas Bresson
S. Lhostis
J. Jourdon
E. Deloffre
S. Guillaumet
Alexis Farcy
Simon Gousseau
M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
4
2018
IRPS
https://doi.org/10.1109/IRPS.2018.8353591
conf/irps/2018
db/conf/irps/irps2018.html#ArnaudMJJLFEEBB18
Lucile Arnaud
M. Arnoux
Viorel Balan
Nicolas Bresson
E. Deloffre
C. Euvrard
Alexis Farcy
Frank Fournel
Simon Gousseau
S. Guillaumet
Imed Jani
J. Jourdon
Amadine Jouve
Didier Lattard
S. Lhostis
Stéphane Moreau