Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Karim Inal

Simon Gousseau Stéphane Moreau David Bouchu Alexis Farcy Pierre Montmitonnet Karim Inal François Bay Marc Zelsmann Emmanuel Picard Mathieu Salaün Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. 1205-1213 2015 55 Microelectron. Reliab. 8 https://doi.org/10.1016/j.microrel.2015.05.019 db/journals/mr/mr55.html#GousseauMBFMIBZ15

K. Adokanou Karim Inal Pierre Montmitonnet F. Pressecq Barbara Bonnet J. L. Muraro Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices. 1697-1702 2015 55 Microelectron. Reliab. 9-10 https://doi.org/10.1016/j.microrel.2015.06.033 db/journals/mr/mr55.html#AdokanouIMPBM15

Sebastian Orellana Brice Arrazat Pascal Fornara Christian Rivero Sylvain Blayac Pierre Montmitonnet Karim Inal Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect. 1896-1900 2015 55 Microelectron. Reliab. 9-10 https://doi.org/10.1016/j.microrel.2015.06.032 db/journals/mr/mr55.html#OrellanaAFRBMI15

K. Adokanou Brice Arrazat François Bay Sylvain Blayac Barbara Bonnet David Bouchu Alexis Farcy Pascal Fornara Simon Gousseau Pierre Montmitonnet Stéphane Moreau J. L. Muraro Sebastian Orellana Emmanuel Picard F. Pressecq Christian Rivero Mathieu Salaün Marc Zelsmann