Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

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Lucile Arnaud M. Arnoux Viorel Balan François Bay David Bouchu Nicolas Bresson E. Deloffre C. Euvrard Y. Exbrayat Alexis Farcy Frank Fournel S. Guillaumet Karim Inal Imed Jani J. Jourdon Amadine Jouve Didier Lattard S. Lhostis Pierre Montmitonnet Stéphane Moreau Emmanuel Picard Mathieu Salaün Marc Zelsmann