Christopher Kapusta
Liang Yin
Cheng-Po Chen
Christopher Kapusta
Reza Ghandi
Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation.
1170-1173
2015
ISCAS
https://doi.org/10.1109/ISCAS.2015.7168847
conf/iscas/2015
db/conf/iscas/iscas2015.html#YinCKG15
Cheng-Po Chen
Reza Ghandi
Liang Yin