Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling.

Karlheinz Bock https://orcid.org/0000-0002-0757-3325 https://www.wikidata.org/entity/Q131934857 Gabriele Patrizi Marco Carratù Karsten Meier Paolo Sommella Antonio Pietrosanto Karlheinz Bock Lorenzo Ciani Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling. 1-6 2025 I2MTC https://doi.org/10.1109/I2MTC62753.2025.11078982 conf/i2mtc/2025 db/conf/i2mtc/i2mtc2025.html#PatriziCMSPBC25 Viktor Dudash Kashi Vishwanath Machani Bjoern Boehme Simone Capecchi Jungtae Ok Karsten Meier Frank Kuechenmeister Marcel Wieland Karlheinz Bock Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. 1-6 2023 IRPS https://doi.org/10.1109/IRPS48203.2023.10117636 conf/irps/2023 db/conf/irps/irps2023.html#DudashMBCOMKWB23 Marco Liess Julian Demicoli Tobias Tiedje Matthias Lohrmann Matthias Nickel M. Luniak Dimitrios A. Prousalis Thomas Wild Ronald Tetzlaff Diana Göhringer Christian Mayr 0001 Karlheinz Bock Sebastian Steinhorst Andreas Herkersdorf X-MAPE: Extending 6G-Connected Self-Adaptive Systems with Reflexive Actions. 163-167 2023 NFV-SDN https://doi.org/10.1109/NFV-SDN59219.2023.10329602 conf/nfvsdn/2023 db/conf/nfvsdn/nfvsdn2023.html#LiessDTLNLPWTGMBSH23

Gerhard P. Fettweis Meik Dorpinghaus Jerónimo Castrillón Akash Kumar 0001 Christel Baier Karlheinz Bock Frank Ellinger Andreas Fery Frank H. P. Fitzek Hermann Härtig Kambiz Jamshidi Thomas Kissinger Wolfgang Lehner Michael Mertig Wolfgang E. Nagel Giang T. Nguyen 0002 Dirk Plettemeier Michael Schröter Thorsten Strufe Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing. 204-231 2019 107 Proc. IEEE 1 https://doi.org/10.1109/JPROC.2018.2874895 https://www.wikidata.org/entity/Q62633027 db/journals/pieee/pieee107.html#FettweisDCKBBEF19

Krzysztof Nieweglowski Lukas Lorenz Sebastian Lüngen Tobias Tiedje Klaus-Jürgen Wolter Karlheinz Bock Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. 121-126 2018 84 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2018.03.020 https://www.wikidata.org/entity/Q130066435 db/journals/mr/mr84.html#NieweglowskiLLT18

Karsten M. Decker René M. Rehmann Mike Roellig Karlheinz Bock Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. 125-132 2018 87 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2018.06.003 https://www.wikidata.org/entity/Q129578048 db/journals/mr/mr87.html#DeckerRRB18

Christian Maleck Gottfried Nieke Karlheinz Bock Detlef Pabst Marcel Stehli A Comparison of an CP and MIP Approach for Scheduling jobs in production areas with Time Constraints and uncertainties. 3526-3537 2018 WSC https://doi.org/10.1109/WSC.2018.8632404 https://dl.acm.org/citation.cfm?id=3320934 conf/wsc/2018 db/conf/wsc/wsc2018.html#MaleckNBPS18 Gottfried Nieke Christian Maleck Karlheinz Bock Marcel Stehli Steffen Kalisch A Mathematical Model for the External Scheduling of a Cluster Tool Workstation. 3538-3549 2018 WSC https://doi.org/10.1109/WSC.2018.8632280 https://dl.acm.org/citation.cfm?id=3320936 conf/wsc/2018 db/conf/wsc/wsc2018.html#NiekeMBSK18 Dirk Doleschal Karlheinz Bock A CP Model for a Scheduling Problem with Limited secondary Resources compared to a des Model. 3684-3695 2018 WSC https://doi.org/10.1109/WSC.2018.8632390 https://dl.acm.org/citation.cfm?id=3320955 conf/wsc/2018 db/conf/wsc/wsc2018.html#DoleschalB18 Mircea Catuneanu Ronny Henker R. Hosseini M. Jazayerifar H. Aminpour David Schoeniger Alexandru Giuglea Krzysztof Nieweglowski Frank Ellinger Karlheinz Bock Kambiz Jamshidi Design considerations and constraints in silicon based optical on-board interconnects for short range communications. 1-4 2017 ICTON https://doi.org/10.1109/ICTON.2017.8024827 conf/icton/2017 db/conf/icton/icton2017.html#CatuneanuHHJASG17 Tetiana Voitsekhivska Felix Zorgiebel Eike Suthau Klaus-Jürgen Wolter Karlheinz Bock Gianaurelio Cuniberti pH measurements of FET-based (bio)chemical sensors using portable measurement system. 6445-6448 2015 EMBC https://doi.org/10.1109/EMBC.2015.7319868 https://www.wikidata.org/entity/Q40137080 conf/embc/2015 db/conf/embc/embc2015.html#VoitsekhivskaZS15 Michael Jenning Bernhard Klein Ronny Hahnel Dirk Plettemeier David Fritsche Gregor Tretter Corrado Carta Frank Ellinger Tobias Nardmann Michael Schröter Krzysztof Nieweglowski Karlheinz Bock Johannes Israel Andreas Fischer 0004 Najeeb ul Hassan Lukas Landau Meik Dorpinghaus Gerhard P. Fettweis Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication. 1-5 2015 ICUWB https://doi.org/10.1109/ICUWB.2015.7324448 conf/icuwb/2015 db/conf/icuwb/icuwb2015.html#JenningKHPFTCEN15

Indranil Bose Kornelius Tetzner Kathrin Borner Karlheinz Bock Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags. 1643-1647 2014 54 Microelectron. Reliab. 9-10 https://doi.org/10.1016/j.microrel.2014.07.050 https://www.wikidata.org/entity/Q57552328 db/journals/mr/mr54.html#BoseTBB14

Stephan Schoenfelder Matthias Ebert Christof Landesberger Karlheinz Bock Jörg Bagdahn Investigations of the influence of dicing techniques on the strength properties of thin silicon. 168-178 2007 47 Microelectron. Reliab. 2-3 https://doi.org/10.1016/j.microrel.2006.09.002 https://www.wikidata.org/entity/Q133465826 db/journals/mr/mr47.html#SchoenfelderELBB07

Karlheinz Bock Polytronik und das Internet der Dinge. 203-218 2007 Internet der Dinge https://doi.org/10.1007/978-3-540-36733-8_14 series/vdi/2007internetdd db/series/vdi/internetdd2007.html#Bock07

Karlheinz Bock Polymer Electronics Systems - Polytronics. 1400-1406 2005 93 Proc. IEEE 8 https://doi.org/10.1109/JPROC.2005.851513 https://www.wikidata.org/entity/Q64026083 db/journals/pieee/pieee93.html#Bock05

Karlheinz Bock Bart Keppens Vincent De Heyn Guido Groeseneken L. Y. Ching A. Naem Influence of gate length on ESD-performance for deep submicron CMOS technology. 375-383 2001 41 Microelectron. Reliab. 3 https://doi.org/10.1016/S0026-2714(00)00243-2 db/journals/mr/mr41.html#BockKHGCN01

H. Aminpour Jörg Bagdahn Christel Baier Bjoern Boehme Kathrin Borner Indranil Bose Simone Capecchi Marco CarratuMarco Carratù Corrado Carta Jerónimo Castrillón Mircea Catuneanu L. Y. Ching Lorenzo Ciani Gianaurelio Cuniberti Karsten M. Decker Julian Demicoli Dirk Doleschal Meik DörpinghausMeik Dorpinghaus Viktor Dudash Matthias Ebert Frank Ellinger Andreas Fery Gerhard P. Fettweis Andreas Fischer 0004 Frank H. P. Fitzek David Fritsche Alexandru Giuglea Diana Göhringer Guido Groeseneken Ronny Hahnel Hermann Härtig Najeeb ul Hassan Ronny Henker Andreas Herkersdorf Vincent De Heyn R. Hosseini Johannes Israel Kambiz Jamshidi M. Jazayerifar Michael Jenning Steffen Kalisch Bart Keppens Thomas Kissinger Bernhard Klein Frank Kuechenmeister Akash Kumar 0001 Lukas Landau Christof Landesberger Wolfgang Lehner Marco Liess Matthias Lohrmann Lukas Lorenz Sebastian Lüngen M. Luniak Kashi Vishwanath Machani Christian Maleck Christian Mayr 0001 Karsten Meier Michael Mertig A. Naem Wolfgang E. Nagel Tobias Nardmann Giang T. Nguyen 0002 Matthias Nickel Gottfried Nieke Krzysztof Nieweglowski Jungtae Ok Detlef Pabst Gabriele Patrizi Antonio Pietrosanto Dirk Plettemeier Dimitrios A. Prousalis René M. Rehmann Mike Roellig Stephan Schoenfelder David Schoeniger Michael Schröter Paolo Sommella Marcel Stehli Sebastian Steinhorst Thorsten Strufe Eike Suthau Ronald Tetzlaff Kornelius Tetzner Tobias Tiedje Gregor Tretter Tetiana Voitsekhivska Marcel Wieland Thomas Wild Klaus-Jürgen Wolter Felix Zorgiebel