{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T11:24:54Z","timestamp":1763724294917},"publisher-location":"New Jersey","reference-count":0,"publisher":"IEEE Conference Publications","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014]]},"DOI":"10.7873\/date.2014.351","type":"proceedings-article","created":{"date-parts":[[2014,4,29]],"date-time":"2014-04-29T23:56:54Z","timestamp":1398815814000},"page":"1-4","source":"Crossref","is-referenced-by-count":11,"title":["3D FPGA using high-density interconnect Monolithic Integration"],"prefix":"10.7873","author":[{"given":"Ogun","family":"Turkyilmaz","sequence":"first","affiliation":[]},{"given":"Gerald","family":"Cibrario","sequence":"additional","affiliation":[]},{"given":"Olivier","family":"Rozeau","sequence":"additional","affiliation":[]},{"given":"Perrine","family":"Batude","sequence":"additional","affiliation":[]},{"given":"Fabien","family":"Clermidy","sequence":"additional","affiliation":[]}],"member":"4628","event":{"number":"17","sponsor":["EDAA","CEDA","EDA Consortium","ACM SIGDA","RAS","ECSI"],"acronym":"DATE14","name":"Design Automation and Test in Europe","start":{"date-parts":[[2014,3,24]]},"theme":"Design, automation, and test","location":"Dresden, Germany","end":{"date-parts":[[2014,3,28]]}},"container-title":["Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014"],"original-title":[],"deposited":{"date-parts":[[2014,4,30]],"date-time":"2014-04-30T00:02:51Z","timestamp":1398816171000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/xpl\/articleDetails.jsp?arnumber=6800552"}},"subtitle":[],"proceedings-subject":"Electronic systems design and test","short-title":[],"issued":{"date-parts":[[2014]]},"references-count":0,"URL":"https:\/\/doi.org\/10.7873\/date.2014.351","relation":{},"subject":[],"published":{"date-parts":[[2014]]}}}