{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T00:28:12Z","timestamp":1725409692311},"reference-count":0,"publisher":"SPIE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,2,10]]},"DOI":"10.1117\/12.872434","type":"proceedings-article","created":{"date-parts":[[2011,2,2]],"date-time":"2011-02-02T23:06:14Z","timestamp":1296687974000},"page":"78750T","source":"Crossref","is-referenced-by-count":2,"title":["A novel 3D architecture for high-dynamic range image sensor and on-chip data compression"],"prefix":"10.1117","volume":"7875","author":[{"given":"F.","family":"Guezzi-Messaoud","sequence":"first","affiliation":[]},{"given":"A.","family":"Dupret","sequence":"additional","affiliation":[]},{"given":"A.","family":"Peizerat","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Blanchard","sequence":"additional","affiliation":[]}],"member":"189","event":{"name":"IS&T\/SPIE Electronic Imaging","location":"San Francisco Airport, California, USA"},"container-title":["SPIE Proceedings","Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications XII"],"original-title":[],"deposited":{"date-parts":[[2016,5,18]],"date-time":"2016-05-18T07:31:01Z","timestamp":1463556661000},"score":1,"resource":{"primary":{"URL":"http:\/\/proceedings.spiedigitallibrary.org\/proceeding.aspx?doi=10.1117\/12.872434"}},"subtitle":[],"editor":[{"given":"Ralf","family":"Widenhorn","sequence":"first","affiliation":[]},{"given":"Val\u00e9rie","family":"Nguyen","sequence":"additional","affiliation":[]}],"short-title":[],"issued":{"date-parts":[[2011,2,10]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1117\/12.872434","relation":{},"ISSN":["0277-786X"],"issn-type":[{"type":"print","value":"0277-786X"}],"subject":[],"published":{"date-parts":[[2011,2,10]]}}}