{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,20]],"date-time":"2025-10-20T10:17:12Z","timestamp":1760955432809},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,5]]},"DOI":"10.1109\/iscas.2013.6572175","type":"proceedings-article","created":{"date-parts":[[2013,8,14]],"date-time":"2013-08-14T11:40:23Z","timestamp":1376480423000},"page":"1632-1635","source":"Crossref","is-referenced-by-count":15,"title":["Disparity vector based advanced inter-view prediction in 3D-HEVC"],"prefix":"10.1109","author":[{"family":"Li Zhang","sequence":"first","affiliation":[]},{"family":"Ying Chen","sequence":"additional","affiliation":[]},{"given":"Marta","family":"Karczewicz","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Common Test Conditions for 3DV Experimentation","year":"2012","key":"13"},{"journal-title":"Calculation of Average PSNR Differences Between RD-Curves","year":"2001","author":"bjontegaard","key":"14"},{"journal-title":"3D-CE5h Related Disparity Vector Derivation for Multiview Video and 3DV","year":"2012","author":"zhang","key":"11"},{"journal-title":"On Motion Information Compression","year":"2011","author":"li","key":"12"},{"journal-title":"High Efficiency Video Coding (HEVC) Text Specification Draft 8","year":"2012","author":"bross","key":"3"},{"journal-title":"3D-HEVC Test Model Description Draft 1","year":"2012","key":"2"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1098\/rsta.1955.0005"},{"journal-title":"Description of 3D Video Technology Proposal by Fraunhofer HHI (HEVC Compatible Configuration A)","year":"2011","author":"schwarz","key":"10"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2009.5167472"},{"journal-title":"Advanced video coding for generic audiovisual services","year":"2012","key":"6"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2007.905532"},{"journal-title":"3D-HEVC Test Model Description Draft 1","year":"2012","author":"tech","key":"4"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/PCS.2012.6213296"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2006.885724"}],"event":{"name":"2013 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2013,5,19]]},"location":"Beijing","end":{"date-parts":[[2013,5,23]]}},"container-title":["2013 IEEE International Symposium on Circuits and Systems (ISCAS2013)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6560459\/6571764\/06572175.pdf?arnumber=6572175","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T17:21:32Z","timestamp":1490203292000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6572175\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,5]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iscas.2013.6572175","relation":{},"subject":[],"published":{"date-parts":[[2013,5]]}}}