{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,12]],"date-time":"2026-05-12T11:04:07Z","timestamp":1778583847594,"version":"3.51.4"},"reference-count":18,"publisher":"Elsevier BV","issue":"3","license":[{"start":{"date-parts":[[2009,3,1]],"date-time":"2009-03-01T00:00:00Z","timestamp":1235865600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1016\/j.microrel.2008.10.010","type":"journal-article","created":{"date-parts":[[2008,11,30]],"date-time":"2008-11-30T09:08:12Z","timestamp":1228036092000},"page":"296-302","source":"Crossref","is-referenced-by-count":41,"title":["Mechanical properties versus temperature relation of individual phases in Sn\u20133.0Ag\u20130.5Cu lead-free solder alloy"],"prefix":"10.1016","volume":"49","author":[{"given":"Feng","family":"Gao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroshi","family":"Nishikawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tadashi","family":"Takemoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jianmin","family":"Qu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2008.10.010_bib1","doi-asserted-by":"crossref","first-page":"95","DOI":"10.1016\/S0927-796X(00)00010-3","article-title":"Lead-free solders in microelectronics","volume":"27","author":"Abtewa","year":"2000","journal-title":"Mater Sci Eng R"},{"issue":"6","key":"10.1016\/j.microrel.2008.10.010_bib2","doi-asserted-by":"crossref","first-page":"30","DOI":"10.1007\/BF02701846","article-title":"The creep properties of lead-free solder joints","volume":"54","author":"Song","year":"2002","journal-title":"JOM"},{"key":"10.1016\/j.microrel.2008.10.010_bib3","doi-asserted-by":"crossref","first-page":"929","DOI":"10.1016\/S0921-5093(01)01079-6","article-title":"Indentation creep of \u03b2-Sn and Sn\u2013Pb eutectic alloy","volume":"319\u2013321","author":"Fujiwara","year":"2001","journal-title":"Mater Sci Eng A"},{"issue":"5","key":"10.1016\/j.microrel.2008.10.010_bib4","doi-asserted-by":"crossref","first-page":"905","DOI":"10.1007\/BF02692546","article-title":"Microstructure and mechanical properties evolution of intermetallics btween Cu and Sn\u20133.5Ag solder doped by Ni\u2013Co additives","volume":"35","author":"Gao","year":"2006","journal-title":"J Electron Mater"},{"issue":"14","key":"10.1016\/j.microrel.2008.10.010_bib5","doi-asserted-by":"crossref","first-page":"4291","DOI":"10.1016\/j.actamat.2004.05.046","article-title":"Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation","volume":"52","author":"Deng","year":"2004","journal-title":"Acta Mater"},{"key":"10.1016\/j.microrel.2008.10.010_bib6","doi-asserted-by":"crossref","first-page":"1397","DOI":"10.1023\/A:1019998212640","article-title":"Microindentation study on the rate sensitivity of non-homogeneous solder alloy","volume":"21","author":"Ma","year":"2002","journal-title":"J Mater Sci Lett"},{"issue":"12","key":"10.1016\/j.microrel.2008.10.010_bib7","doi-asserted-by":"crossref","first-page":"3073","DOI":"10.2320\/matertrans.46.3073","article-title":"Indentation of viscoplastic properties of individual phases in lead-free solder alloy by depth-sensing microindentation","volume":"46","author":"Hamasaki","year":"2005","journal-title":"Mater Trans"},{"key":"10.1016\/j.microrel.2008.10.010_bib8","doi-asserted-by":"crossref","first-page":"514","DOI":"10.1007\/s10854-007-9374-6","article-title":"Nanoindentation for measuring individual phase mechanical properties of lead free solder alloy","volume":"19","author":"Sun","year":"2008","journal-title":"J Mater Sci-Mater Electron"},{"key":"10.1016\/j.microrel.2008.10.010_bib9","doi-asserted-by":"crossref","first-page":"2107","DOI":"10.1007\/s11664-006-0320-9","article-title":"Nanoindentation on SnAgCu Lead-free solder joints and analysis","volume":"35","author":"Xu","year":"2006","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2008.10.010_bib10","doi-asserted-by":"crossref","first-page":"2183","DOI":"10.1016\/0001-6160(88)90319-7","article-title":"A micro-indentation study of superplasticity in Pb, Sn, and Sn-38wt% Pb","volume":"36","author":"Mayo","year":"1988","journal-title":"Acta Metall"},{"key":"10.1016\/j.microrel.2008.10.010_bib11","doi-asserted-by":"crossref","first-page":"973","DOI":"10.1557\/JMR.1992.0973","article-title":"Nanoindentation of nanocrystalline ZnO","volume":"7","author":"Mayo","year":"1992","journal-title":"J Mater Res"},{"key":"10.1016\/j.microrel.2008.10.010_bib12","doi-asserted-by":"crossref","first-page":"2315","DOI":"10.1016\/j.matlet.2005.12.132","article-title":"Mechanical properties evolution of Sn\u20133.5Ag based lead-free solders by nanoindentation","volume":"60","author":"Gao","year":"2006","journal-title":"Mater Lett"},{"issue":"6","key":"10.1016\/j.microrel.2008.10.010_bib13","doi-asserted-by":"crossref","first-page":"1564","DOI":"10.1557\/JMR.1992.1564","article-title":"An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments","volume":"7","author":"Oliver","year":"1992","journal-title":"J Mater Res"},{"issue":"3","key":"10.1016\/j.microrel.2008.10.010_bib14","doi-asserted-by":"crossref","first-page":"1460","DOI":"10.1063\/1.369178","article-title":"Finite-element modeling of nanoindentation","volume":"85","author":"Knapp","year":"1999","journal-title":"J Appl Phys"},{"key":"10.1016\/j.microrel.2008.10.010_bib15","first-page":"437","article-title":"Hardness\u2013temperature relationships in metals","volume":"8","author":"Merchant","year":"1973","journal-title":"J Mater Res"},{"key":"10.1016\/j.microrel.2008.10.010_bib16","first-page":"369","article-title":"Indentation hardness and creep of solids","volume":"94","author":"Atkins","year":"1966","journal-title":"J Inst Met"},{"key":"10.1016\/j.microrel.2008.10.010_bib17","doi-asserted-by":"crossref","first-page":"81","DOI":"10.1115\/1.1525254","article-title":"Creep behavior and deformation mechanism map of Sn\u2013Pb eutectic solder alloy","volume":"125","author":"Shi","year":"2003","journal-title":"J Eng Mater Tech"},{"key":"10.1016\/j.microrel.2008.10.010_bib18","series-title":"Deformation-mechanism maps-the plasticity and creep of metals and ceramics","author":"Frost","year":"1982"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271408003892?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271408003892?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2018,12,24]],"date-time":"2018-12-24T02:27:54Z","timestamp":1545618474000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271408003892"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":18,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2009,3]]}},"alternative-id":["S0026271408003892"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2008.10.010","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2009,3]]}}}